7 research outputs found
Recycling of non-metallic powder from printed circuit board waste as a filler material in a fiber reinforced polymer
Rapid growth in the electricity and electronics industry in Thailand has resulted in numerous problems
with electrical waste management. Printed circuit board (PCB) components contain copper in an
amount of approximately 10 wt. % and approximately 90 wt. % of non-conductive substrate made from
fiberglass resin. In the recycling process, after copper is physically separated from PCB, only nonmetallic
powder (NMP) will be left; that needs to be properly disposed of and managed. Therefore, this
study is a proposal of suitable choices for NMP management. The results showed that NMP can be
disposed in hazardous waste landfill. Furthermore, NMP can be recycled as a component in fiber-
-reinforced polymer (FRP) of the following composition: coarse NMP 25%, fine NMP 25%, polyester
38.8%, hardener (Butanox type) 0.6%, catalyst (cobalt type) 0.6%, styrene monomer 10%. This FRP
mixed with NMP can be properly processed into an artificial wall tile product in terms of mechanical
properties, manufacturing processes and conditions of use