Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process

Advances in joining processes for aluminum and copper are sought after to facilitate the greater adoption of aluminum in electrical applications. Aluminum's chemical affinity to copper causes the joining and lifetime of Al-Cu welds to be vulnerable to the formation of various intermetallic compounds. Intermetallic compounds and the resulting weld structure are known to reduce the structural integrity and increase the electrical resistance of Al-Cu welds. In this study we evaluate the novel joining process, Hybrid Metal Extrusion and Bonding, for butt welding aluminum and copper. The weld structure was examined using scanning and transmission electron microscopy, and the weld resistance was measured using four-point measurements forecast to the weld interface. Energy dispersive spectroscopy and electron diffraction zone axis patterns were analysed to identify intermetallic compounds. Weld samples were examined pre and post heat treatment at 200 °C, 250 °C and 350 °C for total durations of over 1000 h. The results are compared to existing Al-Cu joining processes, and a new metric, weld interface resistivity, is proposed to compare the electrical properties of bimetallic welds. The Hybrid Metal Extrusion and Bonding process was found to form a thin, consistent and straight intermetallic layer with negligible impact on electrical resistance in the as-welded condition. Artificial ageing of samples by heat treatment established the overall growth rate of intermetallic compounds. The growth rate was used to evaluate the weld's operational lifetime versus temperature. The intermetallic growth rate of Hybrid Metal Extrusion and Bonding was quantified at 200 °C and compared to alternative processes. The Hybrid Metal Extrusion and Bonding process showed a significant performance advantage requiring the longest time to reach 2 μm thickness. Furthermore, the growth of intermetallic compounds did not increase the electrical resistance of the weld interface. The negligible impact on electrical resistance and slow intermetallic growth are promising results of the potential functional performance. This study is the first characterisation of the Hybrid Metal Extrusion and Bonding process for electrical applications showcasing its exciting potential for the joining of aluminum and copper.publishedVersio

Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process

Advances in joining processes for aluminum and copper are sought after to facilitate the greater adoption of aluminum in electrical applications. Aluminum's chemical affinity to copper causes the joining and lifetime of Al-Cu welds to be vulnerable to the formation of various intermetallic compounds. Intermetallic compounds and the resulting weld structure are known to reduce the structural integrity and increase the electrical resistance of Al-Cu welds. In this study we evaluate the novel joining process, Hybrid Metal Extrusion and Bonding, for butt welding aluminum and copper. The weld structure was examined using scanning and transmission electron microscopy, and the weld resistance was measured using four-point measurements forecast to the weld interface. Energy dispersive spectroscopy and electron diffraction zone axis patterns were analysed to identify intermetallic compounds. Weld samples were examined pre and post heat treatment at 200 °C, 250 °C and 350 °C for total durations of over 1000 h. The results are compared to existing Al-Cu joining processes, and a new metric, weld interface resistivity, is proposed to compare the electrical properties of bimetallic welds. The Hybrid Metal Extrusion and Bonding process was found to form a thin, consistent and straight intermetallic layer with negligible impact on electrical resistance in the as-welded condition. Artificial ageing of samples by heat treatment established the overall growth rate of intermetallic compounds. The growth rate was used to evaluate the weld's operational lifetime versus temperature. The intermetallic growth rate of Hybrid Metal Extrusion and Bonding was quantified at 200 °C and compared to alternative processes. The Hybrid Metal Extrusion and Bonding process showed a significant performance advantage requiring the longest time to reach 2 μm thickness. Furthermore, the growth of intermetallic compounds did not increase the electrical resistance of the weld interface. The negligible impact on electrical resistance and slow intermetallic growth are promising results of the potential functional performance. This study is the first characterisation of the Hybrid Metal Extrusion and Bonding process for electrical applications showcasing its exciting potential for the joining of aluminum and copper

Preliminary in-situ study of FIB-assisted method for aluminium solid-state welding at the microscale

In situ studies allow real time monitoring and deep comprehension of phenomena. This approach has been applied to the current research for the development of a novel solid-state welding technique at the microscale. The downscaling of the process has been inspired by Cold Pressure Welding (CPW) working principles and it has been carried out by a tailored setup of a high-resolution Focused Ion Beam – Scanning Electron Microscope (FIB-SEM). This work is primarily aimed at showing how FIB functionalities can be expanded and discussing the challenges that may be encountered by doing that. Therefore, a preliminary FIB-assisted methodology for cold bonding of AA1070 and AA6082 aluminium alloys at the microscale is presented. In situ cross-sectioning of the weld and proper scanning-electron imaging have revealed that, under certain pressure conditions, oxide-free aluminium interfaces are able to be joined at room temperature even at the microscale. Experimental technique improvement and testing of the obtained joints are the next steps needed in this research

Al-Cu intermetallic phase growth in hybrid metal extrusion & bonding welds exposed to isothermal annealing or direct current cycling

Joining of aluminium (Al) to copper (Cu) is of great interest to power generation, transportation and electronic industry. However, dissimilar metal joining often promotes intermetallic phase formation at the joined interface, which in redundancy can cause mechanical degradation and increased electrical resistance. The welding technique hybrid metal extrusion &amp; bonding (HYB) is proven capable of joining dissimilar metals with a total intermetallic phase layer thickness < Image 1. To test how Al-Cu HYB joints perform as electrical conductors, a 6101 Al alloy HYB-welded to Cu is exposed to heat treatment at Image 2 or cycling of direct current density up to Image 3. In-depth micro- and nanostructure characterisation by (scanning) transmission electron microscopy and atom probe tomography are used to describe the structure and chemistry of the formed intermetallic phases.The Al-Cu HYB joints exhibited resilience against intermetallic phase growth during isothermal heat treatment or exposure to electric current. However, a non-symmetry is observed dependent on the current direction, creating voids in Cu near, and in the intermetallic layers when the current goes from Al to Cu. Detailed microstructure characterisation unveils Si and Mg in the intermetallic phase layers. Their origin and role in intermetallic phase growth are discussed