Recovery of off-state stress-induced damage in FET-type gas sensor using self-curing method

The need for high-performance gas sensors is driven by concerns over indoor and outdoor air quality, and industrial gas leaks. Due to their structural diversity, vast surface area, and geometric tunability, metal oxides show significant potential for the development of gas sensing systems. Despite the fact that several previous reports have successfully acquired a suitable response to various types of target gases, it remains difficult to maintain the reliability of metal oxide-based gas sensors. In particular, the degradation of the sensor platform under repetitive operation, such as off-state stress (OSS) causes significant reliability issues. We investigate the impact of OSS on the gas sensing performances, including response, low-frequency noise, and signal-to-noise ratio of horizontal floating-gate field-effect-transistor (FET)-type gas sensors. The 1/f noise is increased after the OSS is applied to the sensor because the gate oxide is damaged by hot holes. Therefore, the SNR of the sensor is degraded by the OSS. We applied a self-curing method based on a PN-junction forward current at the body–drain junction to repair the damaged gate oxide and improve the reliability of the sensor. It has been demonstrated that the SNR degradation caused by the OSS can be successfully recovered by the self-curing method

Highly Efficient Self-Curing Method in MOSFET Using Parasitic Bipolar Junction Transistor

© 1980-2012 IEEE.We propose a hybrid self-curing method based on the parasitic bipolar junction transistor (PBJT) inherent to metal-oxide-semiconductor field-effect transistor (MOSFET). The PBJT utilizes the positive feedback of impact ionization to flow a large current close to the channel, generating Joule heat. Unlike conventional self-curing methods, the PBJT-based self-curing recovers the damaged gate oxide along the lateral dimension of the entire channel. The effects of the hybrid curing are quantitatively verified by low-frequency noise spectroscopy and charge pumping method.N

Investigation of Low-Frequency Noise Characteristics of Ferroelectric Tunnel Junction: From Conduction Mechanism and Scaling Perspectives

We investigate the effects of length (L) and width (W) scaling on the low-frequency noise characteristics of the ferroelectric tunnel junction (FTJ). The FTJ is composed of metal/ferroelectric/dielectric/semiconductor (TiN/HfZrO2/SiO2/n(+) Si). In the high-resistance state, 1/f noise increases proportionally to 1/(WL beta)-L-alpha(alpha congruent to 1, beta > 1), whereas the shot noise has no scaling dependence. In the low-resistance state, the 1/f noise of the FTJ shows a more sensitive dependence on L scaling than W scaling since the switching and conduction mechanisms are more affected by the process-induced damaged edge regions.N

Unveiled Influence of Sub‐gap Density of States on Low‐Frequency Noise in Si‐Doped ZnSnO TFTs: Does Correlated Mobility Fluctuation Model Suffice?

Abstract The presence of low‐frequency noise (LFN) in amorphous oxide semiconductor (AOS) thin‐film transistors (TFTs) is of utmost concern, prompting extensive investigations into the analysis of LFN. However, prior research endeavors have tended to overlook the significance of the sub‐gap density of states (DOS) in the LFN analysis, resulting in an incomplete comprehension. To bridge this knowledge gap, the influence of sub‐gap DOS is demonstrated on LFN in Si‐doped ZnSnO (SZTO) thin‐film transistors (TFTs) under various conditions. The SZTO TFTs is intentionally subjected to positive bias stress and hot carrier stress in order to control the sub‐gap DOS and investigate how this change affects the LFN characteristics. It is revealed that the non‐uniform energetic distribution of sub‐gap DOS induces bias‐dependent excess noise in the SZTO TFTs. Additionally, self‐recovery behavior after the HCS is observed, accompanied by a commensurate reduction in 1/f noise. These empirical observations provide evidence that the conventional correlated mobility fluctuation model used to explain LFN in AOS TFTs is insufficient and underscores the critical importance of considering subgap DOS when analyzing LFN of AOS TFTs

Analog Synaptic Devices Based on IGZO Thin‐Film Transistors with a Metal–Ferroelectric–Metal–Insulator–Semiconductor Structure for High‐Performance Neuromorphic Systems

A ferroelectric thin‐film transistor (FeTFT)‐based synaptic device with an indium–gallium–zinc oxide (IGZO) channel and a metal–ferroelectric–metal–insulator–semiconductor (MFMIS) structure is reported. The fabricated FeTFT exhibits a highly linear conductance response (|α| = 0.21) with a large dynamic range (Gmax/Gmin ≈ 53.2), although identical program pulses are applied to the device. In addition, because the inner metal layer of the FeTFTs has an MFMIS structure, the electric field is uniformly applied to the entire IGZO channel, which reduces the cycle‐to‐cycle variation (σ = 0.47%) in the conductance responses. In the system simulation with the measured synaptic characteristics, the high classification accuracy of ≈97.0% is achieved in the MNIST image set, verifying the feasibility of FeTFT‐based neuromorphic systems