RF-MEMS Switches on a Printed Circuit Board Platform

Purpose: The purpose of this paper is to present a new class of printed circuit board (PCB)-based, radio frequency micro-electro-mechanical systems (RF-MEMS) switches and to describe the packaging method and evaluate performance. Design/methodology/approach: Traditional PCB materials and processes were combined with photolithographic high-density interconnect (HDI) and MEMS to form 3D high-performance RF switches. Findings: A new type of MEMS RF switch has been developed on a PCB platform. Using processes analogous to those used for silicon MEMS, PCB, and HDI technologies were utilized to fabricate these 3D structures. The PCB-based microstructures are mil-scale rather than the micro-scale of silicon MEMs. A co-fabrication packaging method for the MEMS RF switch was also developed. The PCB-based MEMS switches have demonstrated excellent RF performance and hot-switching RF power-handling capability. PCB-based MEMS RF switches have the advantages of low cost and amenability to scale-up for a high degree of integration. Research limitations/implications: Further development on photo imageable dielectric materials will enable this technology to improve yield and processability. Originality/value: The paper describes the development of PCB-based MEMS RF switches. These elements will enable new applications and enhance the functionality of PCBs. They are also more amenable to system integration compared with silicon MEMS