3D Printing Polymeric Materials for Robots with Embedded Systems

The fabrication of robots and their embedded systems is challenging due to the complexity of the interacting components. The integration of additive manufacturing (AM) to robotics has made advancements in robotics manufacturing through sophisticated and state-of-the-art AM technologies and materials. With the emergence of 3D printing, 3D printing materials are also being considered and engineered for specific applications. This study reviews different 3D printing materials for 3D printing embedded robotics. Materials such as polyethylene glycol diacrylate (PEGDA), acrylonitrile butadiene styrene (ABS), flexible photopolymers, silicone, and elastomer-based materials were found to be the most used 3D printing materials due to their suitability for robotic applications. This review paper revealed that the key areas requiring more research are material formulations for improved mechanical properties, cost, and the inclusion of materials for specific applications. Future perspectives are also provided

3D Printing Polymeric Materials for Robots with Embedded Systems

The fabrication of robots and their embedded systems is challenging due to the complexity of the interacting components. The integration of additive manufacturing (AM) to robotics has made advancements in robotics manufacturing through sophisticated and state-of-the-art AM technologies and materials. With the emergence of 3D printing, 3D printing materials are also being considered and engineered for specific applications. This study reviews different 3D printing materials for 3D printing embedded robotics. Materials such as polyethylene glycol diacrylate (PEGDA), acrylonitrile butadiene styrene (ABS), flexible photopolymers, silicone, and elastomer-based materials were found to be the most used 3D printing materials due to their suitability for robotic applications. This review paper revealed that the key areas requiring more research are material formulations for improved mechanical properties, cost, and the inclusion of materials for specific applications. Future perspectives are also provided