Increasing the biorelevance of simulated intestinal fluids for better predictions of drug equilibrium solubility in the fasted upper small intestine

To date the importance of luminal species other than bile salts and phosphatidylcholine on drug equilibrium solubility in the fasted upper small intestine has been evaluated to a very limited extent. In this communication the importance of fatty acids, cholesterol, and proteins on solubility of four model lipophilic compounds was evaluated by including these components into previously proposed simulated intestinal fluids. Data were compared with ex vivo solubility data in aspirates reflecting the mean and the median luminal composition in the upper small intestine. It is concluded that estimation of solubility in aspirates reflecting the median luminal composition is better estimated when the presence of cholesterol and fatty acids is also simulated. In contrast, estimation of solubility in aspirates reflecting the mean luminal composition requires consideration of additional factors (e.g. buffer species identity, non-micellar colloidal structures, and lyso-phosphatidylcholine content)

A fully coupled thermo-hydro-mechanical elastoplastic damage model for fractured rock

A detailed and fully coupled thermo-hydro-mechanical (THM) model for fractured rock is presented. This model distinguishes itself by harmoniously integrating elastoplastic material behaviour with a continuum damage mechanics framework. Solid matrix displacement, pore and fissure water pressures and temperature of the solid are introduced as the primary nodal variables. The ingenuity of this research is embedded in the intricate coupling of THM processes with plastic deformation and damage mechanics in a double porous medium, a venture that significantly broadens the remit of existing methodologies. The model is implemented using finite element method (FEM) and validation is achieved by comparing the FEM results against existing literature numerical outcomes describing linear and elastoplastic continuum damage behaviour of fractured rock. The model also exhibits an extraordinary proficiency in reproducing experimental triaxial test results, using THM components conjoined with elastoplastic bounding surface aspects and inherent hardening effects. It is imperative, nonetheless, to underscore the model's sensitivity to certain material properties, inclusive of strength parameters, leakage coefficients, and permeability attributes. This fully coupled THM model provides a comprehensive and sophisticated tool for investigating the behaviour of fractured rock under various loading conditions. It can help us better understand the physics of fractured rock behaviour and contribute to the development of more accurate and reliable models for engineering applications, such as CO2 injection.</p

Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components

Current challenges in printed circuit board (PCB) assembly require high-resolution deposition of ultra-fine pitch components (&lt;0.3 mm and &lt;60 μm respectively), high throughput and compatibility with flexible substrates, which are poorly met by the conventional deposition techniques (e.g., stencil printing). Laser-Induced Forward Transfer (LIFT) constitutes an excellent alternative for assembly of electronic components: it is fully compatible with lead-free soldering materials and offers high-resolution printing of solder paste bumps (&lt;60 μm) and throughput (up to 10,000 pads/s). In this work, the laser-process conditions which allow control over the transfer of solder paste bumps and arrays, with form factors in line with the features of fine pitch PCBs, are investigated. The study of solder paste as a function of donor/receiver gap confirmed that controllable printing of bumps containing many microparticles is feasible for a gap &lt; 100 μm from a donor layer thickness set at 100 and 150 μm. The transfer of solder bumps with resolution &lt; 100 μm and solder micropatterns on different substrates, including PCB and silver pads, have been achieved. Finally, the successful operation of a LED interconnected to a pin connector bonded to a laser-printed solder micro-pattern was demonstrated