18 research outputs found
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Use of composite materials, health monitoring and self-healing concepts to refurbish our civil and military infrastructure.
An unavoidable by-product of a metallic structure's use is the appearance of crack, corrosion, erosion and other flaws. Economic barriers to the replacement of these structures have created an aging civil and military infrastructure and placed even greater demands on efficient and safe repair and inspection methods. As a result of Homeland Security issues and these aging infrastructure concerns, increased attention has been focused on the rapid repair and preemptive reinforcement of structures such as buildings and bridges. This Laboratory Directed Research and Development (LDRD) program established the viability of using bonded composite patches to repair metallic structures. High modulus fiber-reinforced polymer (FRP) material may be used in lieu of mechanically fastened metallic patches or welds to reinforce or repair damaged structures. Their use produces a wide array of engineering and economic advantages. Current techniques for strengthening steel structures have several drawbacks including requiring heavy equipment for installation, poor fatigue performance, and the need for ongoing maintenance due to continued corrosion attack or crack growth. The use of bonded composite doublers has the potential to correct the difficulties associated with current repair techniques and the ability to be applied where there are currently no rehabilitation options. Applications include such diverse structures as: buildings, bridges, railroad cars, trucks and other heavy machinery, steel power and communication towers, pipelines, factories, mining equipment, ships, tanks and other military vehicles. This LDRD also proved the concept of a living infrastructure by developing custom sensors and self-healing chemistry and linking this technology with the application of advanced composite materials. Structural Health Monitoring (SHM) systems and mountable, miniature sensors were designed to continuously or periodically assess structural integrity. Such systems are able to detect incipient damage before catastrophic failure occurs. The ease of monitoring an entire network of distributed sensors means that structural health assessments can occur more often, allowing operators to be even more vigilant with respect to flaw onset. In addition, the realization of smart structures, through the use of in-situ sensors, allows condition-based maintenance to be substituted for conventional time-based maintenance practices. The sensitivity and reliability of a series of sensor systems was quantified in laboratory and real-world environments. Finally, self healing methods for composite materials were evolved--using resin modules that are released in response to the onset of delaminations--so that these components can provide a living infrastructure with minimal need for human intervention. This program consisted of four related research elements: (1) design, installation, and performance assessment of composite repairs, (2) in-situ sensors for real-time health monitoring, (3) self healing of in-service damage in a repair, and (4) numerical modeling. Deployment of FRP materials and bonded joints requires proper design, suitable surface preparation methods, and adequate surveillance to ensure structural integrity. By encompassing all 'cradle-to-grave' tasks --including design, analysis, installation, durability, flaw containment, and inspection--this program is designed to firmly establish the capabilities of composite doubler repairs and introduce technology to incorporate self-monitoring and self-healing (living structures) methodologies. A proof-of-concept repair was completed on a steel highway bridge in order to demonstrate the potential of composite doubler technology for critical infrastructure use
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Effect of nanoscale patterned interfacial roughness on interfacial toughness.
The performance and the reliability of many devices are controlled by interfaces between thin films. In this study we investigated the use of patterned, nanoscale interfacial roughness as a way to increase the apparent interfacial toughness of brittle, thin-film material systems. The experimental portion of the study measured the interfacial toughness of a number of interfaces with nanoscale roughness. This included a silicon interface with a rectangular-toothed pattern of 60-nm wide by 90-nm deep channels fabricated using nanoimprint lithography techniques. Detailed finite element simulations were used to investigate the nature of interfacial crack growth when the interface is patterned. These simulations examined how geometric and material parameter choices affect the apparent toughness. Atomistic simulations were also performed with the aim of identifying possible modifications to the interfacial separation models currently used in nanoscale, finite element fracture analyses. The fundamental nature of atomistic traction separation for mixed mode loadings was investigated
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Molecular-To-Continuum Fracture Analysis of Thermosetting Polymer/Solid Interfaces
This report focuses on the relationship between the fundamental interactions acting across an interface and macroscopic engineering observable such as fracture toughness or fracture stress. The work encompasses experiment, theory, and simulation. The model experimental system is epoxy on polished silicon. The interfacial interactions between the substrate and the adhesive are varied continuously using self-assembling monolayer. Fracture is studied in two specimen geometries: a napkin-ring torsion geometry and a double cantilevered beam specimen. Analysis and modeling involves molecular dynamics simulations and continuum mechanics calculations. Further insight is gained from analysis of measurements in the literature of direct force measurements for various fundamental interactions. In the napkin-ring test, the data indicate a nonlinear relationship between interface strength and fracture stress. In particular, there is an abrupt transition in fracture stress which corresponds to an adhesive-to-cohesive transition. Such nonlinearity is not present in the MD simulations on the tens-of-nanometer scale, which suggests that the nonlinearity comes from bulk material deformation occurring on much larger length scales. We postulate that the transition occurs when the interface strength becomes comparable to the yield stress of the material. This postulate is supported by variation observed in the fracture stress curve with test temperature. Detailed modeling of the stress within the sample has not yet been attempted. In the DCB test, the relationship between interface strength and fracture toughness is also nonlinear, but the fracture mechanisms are quite different. The fracture does not transition from adhesive to cohesive, but remains adhesive over the entire range of interface strength. This specimen is modeled quantitatively by combining (i) continuum calculations relating fracture toughness to the stress at 90 {angstrom} from the crack tip, and (ii) a relationship from molecular simulations between fracture stress on a {approx} 90 {angstrom} scale and the fraction of surface sites which chemically bond. The resulting relationship between G{sub c} and fraction of bonding sites is then compared to the experimental data. This first order model captures the nonlinearity in the experimentally-determined relationship. A much more extensive comparison is needed (calculations extending to higher G{sub c} values, experimental data extending to lower G{sub c} values) to guide further model development
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Micromechanical Failure Analyses for Finite Element Polymer Modeling
Polymer stresses around sharp corners and in constrained geometries of encapsulated components can generate cracks leading to system failures. Often, analysts use maximum stresses as a qualitative indicator for evaluating the strength of encapsulated component designs. Although this approach has been useful for making relative comparisons screening prospective design changes, it has not been tied quantitatively to failure. Accurate failure models are needed for analyses to predict whether encapsulated components meet life cycle requirements. With Sandia's recently developed nonlinear viscoelastic polymer models, it has been possible to examine more accurately the local stress-strain distributions in zones of likely failure initiation looking for physically based failure mechanisms and continuum metrics that correlate with the cohesive failure event. This study has identified significant differences between rubbery and glassy failure mechanisms that suggest reasonable alternatives for cohesive failure criteria and metrics. Rubbery failure seems best characterized by the mechanisms of finite extensibility and appears to correlate with maximum strain predictions. Glassy failure, however, seems driven by cavitation and correlates with the maximum hydrostatic tension. Using these metrics, two three-point bending geometries were tested and analyzed under variable loading rates, different temperatures and comparable mesh resolution (i.e., accuracy) to make quantitative failure predictions. The resulting predictions and observations agreed well suggesting the need for additional research. In a separate, additional study, the asymptotically singular stress state found at the tip of a rigid, square inclusion embedded within a thin, linear elastic disk was determined for uniform cooling. The singular stress field is characterized by a single stress intensity factor K{sub a} and the applicable K{sub a} calibration relationship has been determined for both fully bonded and unbended inclusions. A lack of interfacial bonding has a profound effect on inclusion-tip stress fields. A large radial compressive stress is generated in front of the inclusion-tip when the inclusion is well bonded, whereas a large tensile hoop stress is generated when the inclusion is unbended, and frictionless sliding is allowed. Consequently, an epoxy disk containing an unbended inclusion appears more likely to crack when cooled than a disk containing a fully bonded inclusion. A limited number of tests have been carried out to determine if encapsulant cracking can be induced by cooling a specimen fabricated by molding a square, steel insert within a thin, epoxy disk. Test results are in qualitative agreement with analysis. Cracks developed only in disks with mold-released inserts, and the tendency for cracking increased with inclusion size
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Process-Based Quality Tools to Verify Cleaning and Surface Preparation
A test method, the Tensile Brazil Nut Sandwich (TBNS) specimen, was developed to measure mixed-mode interfacial toughness of bonded materials. Interfacial toughness measured by this technique is compared to the interfacial toughness of thin film adhesive coatings using a nanoindentation technique. The interfacial toughness of solvent-cast and melt-spun adhesive thin films is compared and found to be similar. Finally, the Johnson-Kendall-Roberts (JKR) technique is used to evaluate the cleanliness of aluminum substrates