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1 research outputs found
Transient-Liquid-Phase Bonding of H230 Ni-Based Alloy Using Ni-P Interlayer: Microstructure and Mechanical Properties
Author
A. Egbewande
A. Ekrami
+30Â more
A. Ghoneim
A. Lis
A. Sakamoto
ASTM standard E8
Brian K. Paul
Casey S. Carney
D.J. Larson
E.E. Underwood
F. Jalilian
G.O. Cook
H. Chuang
H.M. Tawancy
J.-O. Andersson
L.M. Pike
M. Pouranvari
M. Tseng
M. Wang
M.A. Arafin
M.A. Arafin
Monica Kapoor
N.S. Bosco
N.S. Bosco
O.A. Idowu
O.A. Ojo
Patrick McNeff
R. Bakhtiari
Rajesh V. Saranam
T.C. Illingworth
W. Gale
Ömer N. Doğan
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
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