The effect of Sb addition on Sn-based alloys for high-T lead-free solders: an investigation of the Ag-Sb-Sn system

none4Today there is renewed interest in alloys belonging to the Sb-Sn-X (X = Cu, Ag, Bi) ternary systems and their phase equilibria, phase transformations, and thermodynamic properties because of their possible use as high-temperature lead-free solders in the electronics industry. The integral mixing enthalpy of Ag-Sb-Sn liquid alloys has been measured along five different sections (Ag(0.25)Sn(0.75), Ag(0.50)Sn(0.50), Sb(0.30)Sn(0.70), Sb(0.50)Sn(0.50), and Sb(0.70)Sn(0.30)) at 530A degrees C, 600A degrees C, and 630A degrees C, using a high-temperature Calvet calorimeter by dropping pure elements (Ag or Sb) in the binary alloy liquid bath. The ternary extrapolation models of Muggianu and Toop were used to calculate the integral enthalpy of mixing and to compare measured and extrapolated values. Selected ternary alloys have been prepared for thermal investigation by using a differential scanning calorimeter at different heating/cooling rates in order to clarify the temperature of the invariant reactions and the crystallization path.Articolo pubblicato su rivista internazionale peer-reviewed e presente anche a stampa.D. Li; S. Delsante; A. Watson; G. BorzoneD., Li; Delsante, Simona; A., Watson; Borzone, Gabriell