The New Center for Advanced Energy Studies

A secure and affordable energy supply is essential for achieving U.S. national security, in continuing U.S. prosperity and in laying the foundation to enable future economic growth. The next generation energy workforce in the U.S. is a critical element in meeting both national and global energy needs. The Center for Advanced Energy Studies (CAES) was established in 2005 in response to U.S. Department of Energy (DOE) requirements. CAES, located at the new Idaho National Laboratory (INL), will address critical energy education, research, policy study and training needs. CAES is a unique joint partnership between the Battelle Energy Alliance (BEA), the State of Idaho, an Idaho University Consortium (IUC), and a National University Consortium (NUC). CAES will be based in a new facility that will foster collaborative academic and research efforts among participating institutions

SmartSensX. Ein Konzept für vernetzte tragbare Sensoren zur Anwendung in der Softrobotik und Mensch Maschine Interaktion

Technical support systems, such as soft orthotic assistive robots or exoskeletons, provide an additional level of interaction between humans and the environment. Knowledge of physical parameters (e.g. speed, distance, etc.) in this level enables the use of active, controlled support mechanisms. Therefore, in the context of support systems close to the human body and in soft robotics, it is necessary to develop "soft sensor systems" that present new possibilities in design and application. SmartSensX is the implementation of a sensor network consisting of a main unit and several sensor modules with inertial sensors worn close to the body. The sensor modules have the character of embedded systems – they can be connected or disconnected during operation (plug and play). The concept enables the integration of various other sensor types by using a common transmission protocol. Data transfer takes place by wire on elastic, skin-compatible printed circuit boards made of polyurethane (TWINflex-Stretch) or textile-integrated on e-textiles. Another possibility for data transfer between the main unit and sensor modules is the USB 3.1 Type C interface. The sensor modules are arranged in a bus topology. Differential signal transmission is used to increase the sensor modules’ robustness against signal noise. The measured values of the sensor network are recorded, processed, and transmitted in real time

New-generation interconnect

A new-generation interconnect for optical backplane systems based on printed circuits board is presented for transmitting data via integrated multimode polymer optical waveguides both on electro-optical transmitter/receiver processing boards and on optical backplane board. Different developments concerning this system such as optical waveguide technology, transmitter/receiver module activities, and optical interconnect/coupling concepts are discussed

Thin glass based electrical-optical circuit boards (EOCB) using ion-exchange technology for graded-index multimode waveguides

The concept and experimental results to manufacture electrical-optical circuit boards (EOCB) with buried optical waveguides using thin-glass sheets (display glass) are presented. An ion-exchange process was developed to manufacture the graded index waveguides in thin-glass sheets. Besides of their excellent optical properties no mechanical structuring is necessary for the waveguides. Their properties were simulated and experimentally validated. The circuit board assembly is presented, as well as the concept developed for the optical coupling in the module-to-board and board-to-backplane coupling, and the assembly of the pluggable electrical-optical module itself is described

Electro-optical circuit boards using thin-glass sheets with integrated optical waveguides

The following paper presents research on the manufacture of circuit boards with buried optical waveguides using thin-glass sheets (display glass), which represents a further development of earlier research on buried optical waveguide substrates using polymer. An ion-exchange process was developed to manufacture the waveguides in thin-glass sheets, thereby eliminating the necessity of mechanically structuring the layers. The waveguide properties were simulated and experimentally validated. The circuit board assembly and the concept for the optical coupling from the module to the board and from the board to the backplane are presented. The design and assembly of pluggable electro-optical transmitter and receiver modules is described

Embedding technologies for an automotive radar system

Radar sensors are already employed in production model vehicles e.g. for adaptive cruise control (ACC) systems. Further development of driver assistance systems has also led to the use of radar sensors in active safety systems (active brake assistance, collision warning, emergency braking, etc). However, the costs of manufacturing such radar-based systems, capable of gathering reliable information from surroundings, for vehicles across the market spectrum or for compact executive cars are still too high. Thus, despite the improved reliability characteristics, detection properties and safety required for these sensors, the aim is to manufacture such systems more cost-effectively. The German national "KRAFAS (Cost-optimized Radar Sensor for Active Driver Assistance Systems)" project is aiming at integrating 77 GHz components (esp. SiGe MMICs) into a printed circuit board, combining driver and 77 GHz RF circuitry and integrating antenna elements. This will significantly reduce current costs of the 77 GHz RF module by 20-30%. A sketch of such a module with an adapted cylindrical radar lens is depicted in Figure 1. [GRAPHICS] In this paper, design, simulation, technological development, demonstrator realization and subsequent measurement of interconnects of embedded active 77 GHz chips to a high frequency substrate using microvia technology is described. The used molded embedding technology offers great opportunities for a very broad range of frequencies and applications as well as large potential for cost reduction