Maskless micro/nanofabrication on GaAs surface by friction-induced selective etching

In the present study, a friction-induced selective etching method was developed to produce nanostructures on GaAs surface. Without any resist mask, the nanofabrication can be achieved by scratching and post-etching in sulfuric acid solution. The effects of the applied normal load and etching period on the formation of the nanostructure were studied. Results showed that the height of the nanostructure increased with the normal load or the etching period. XPS and Raman detection demonstrated that residual compressive stress and lattice densification were probably the main reason for selective etching, which eventually led to the protrusive nanostructures from the scratched area on the GaAs surface. Through a homemade multi-probe instrument, the capability of this fabrication method was demonstrated by producing various nanostructures on the GaAs surface, such as linear array, intersecting parallel, surface mesas, and special letters. In summary, the proposed method provided a straightforward and more maneuverable micro/nanofabrication method on the GaAs surface

Precision-improving manufacturing produces ordered ultra-fine grained surface layer of tungsten heavy alloy through ultrasonic elliptical vibration cutting

High-precision and ultra-fine grained surface of tungsten heavy alloy exhibits superior service performance that is useful for many applications and shows promises for use as key parts in nuclear protection and precision instruments. The present study concentrated on a kind of precision-improving ultrasonic elliptic vibration cutting approaches, which fabricated nanometer-level surface roughness, inhibited subsurface damages evolution, and formed continuous ultra-fine grained layer microstructure. The surface morphologies have been characterized by ultra-depth three dimensional microscope and white light interferometer. Excellent machined surface quality was achieved under ultrasonic elliptic vibration cutting condition, and an ideal surface roughness of Sa = 70.7 nm was obtained. Microstructural alteration studied using EBSD technique and TEM observation confirmed the generation of ultra-fine grained structure. Surface grain size has been reduced from 50 ∼ 100 μm to 50 ∼ 300 nm without cracks and other micro-damages. Research demonstrated that surface energy accumulation and dislocations clustering induced by high-strain rate diamond tool impact provided the primary driving force of ductile-mode removal and grain recrystallization. A dislocation density-based simulation model was carried out to complement the static experimental investigations. The present work on surface formation and microstructural evolution identified that ultrasonic elliptical vibration machining has potential to deliver improved tungsten-based alloys service performance

AFM probe for measuring ∼10−5 ultra-low friction coefficient: Design and application

Abstract Superlubricity provides a novel approach to addressing friction and wear issues in mechanical systems. However, little is known regarding improving the atomic force microscope (AFM) friction coefficient measurement resolution. Accordingly, this study established the theoretical formula for the AFM friction coefficient measurement and deduced the measurement resolution. Then, the formula was applied to the AFM probe with a rectangular cross-section cantilever. The measurement resolution is associated with the dimensional properties of the AFM probe, the mechanical properties of the cantilever material, the properties of the position-sensitive detector (PSD), and probably the anti-vibration performance of the AFM. It is feasible to make the cantilever as short as possible and the tip as high as possible to improve the measurement resolution. An AFM probe for measuring an ultra-low friction coefficient was designed and fabricated. The cantilever’s length, width, and thickness are 50, 35, and 0.6 µm, respectively. The tip height is 23 µm. The measurement resolution can reach 7.1×10−6 under the maximum normal force. Moreover, the AFM probe was applied to measure the superlubricity between graphene layers. The friction coefficient is 0.00139 under 853.08 nN. This work provides a promising method for measuring a ∼10−5 friction coefficient of superlubricity

Nanofretting behaviors of NiTi shape memory alloy

Nanofretting refers to cyclic movements of contact interfaces with the relative displacement amplitude at the nanometer scale, where the contact area and normal load are usually much smaller than those in fretting. Nanofretting widely exists in microelctromechanical systems (MEMS) and may become a key tribological concern besides microwear and adhesion. With a triboindenter, the nanofretting behaviors of a nickel titanium (NiTi) shape memory alloy are studied under various normal loads (1&ndash;10 mN) and tangential displacement amplitudes (2&ndash;500 nm) by using a spherical diamond tip. Similar to fretting, the nanofretting of NiTi/diamond pair can also be divided into different regimes upon various shapes of tangential force&ndash;displacement curves. The dependence of nanofretting regime on the normal load and the displacement amplitude can be summarized in a running condition nanofretting map. However, due to the surface and size effects, nanofretting operates at some different conditions, such as improved mechanical properties of materials at the nanometer scale, small apparent contact area and single-asperity contact behavior. Consequently, different from fretting, nanofretting was found to exhibit several unique behaviors: (i) the maximum tangential force in one cycle is almost unchanged during a nanofretting test, which is different from a fretting test where the maximum tangential force increases rapidly in the first dozens of cycles; (ii) the tangential stiffness in nanofretting is three orders magnitude smaller than that in fretting; (iii) the friction coefficient in nanofretting is much lower than that in fretting in slip regime; (iv) no obvious damage was observed after 50 cycles of nanofretting under a normal load of 10 mN.<br /

Determination of transformation stresses of shape memory alloy thin films : a method based on spherical indentation

The forward and reverse transformation processes of superelastic shape memory alloys (SMAs) under spherical indentation are analyzed. We found that there exist two characteristic points, the bifurcating point and the returning point, in an indentation curve. The corresponding bifurcation force and return force, respectively, rely on the forward transformation stress and the reverse transformation stress. A method to determine the transformation stresses of SMA from the measure of the bifurcation and return forces is proposed. Additionally, we suggest a slope approach to determine the values of the two forces with high accuracy. (c) 2006 American Institute of Physics

Effect of oxide film on nanoscale mechanical removal of pure iron

Abstract In this paper, the properties of an oxide film formed on a pure iron surface after being polished with an H2O2-based acidic slurry were investigated using an atomic force microscope (AFM), Auger electron spectroscopy (AES), and angle-resolved X-ray photoelectron spectroscopy (AR-XPS) to partly reveal the material removal mechanism of pure iron during chemical mechanical polishing (CMP). The AFM results show that, when rubbed against a cone-shaped diamond tip in vacuum, the material removal depth of the polished pure iron first slowly increases to 0.45 nm with a relatively small slope of 0.11 nm/μN as the applied load increases from 0 to 4 μN, and then rapidly increases with a large slope of 1.98 nm/μN when the applied load further increases to 10 μN. In combination with the AES and AR-XPS results, a layered oxide film with approximately 2 nm thickness (roughly estimated from the sputtering rate) is formed on the pure iron surface. Moreover, the film can be simply divided into two layers, namely, an outer layer and an inner layer. The outer layer primarily consists of FeOOH (most likely α-FeOOH) and possibly Fe2O3 with a film thickness ranging from 0.36 to 0.48 nm (close to the 0.45 nm material removal depth at the 4 μN turning point), while the inner layer primarily consists of Fe3O4. The mechanical strength of the outer layer is much higher than that of the inner layer. Moreover, the mechanical strength of the inner layer is quite close to that of the pure iron substrate. However, when a real CMP process is applied to pure iron, pure mechanical wear by silica particles generates almost no material removal due to the extremely high mechanical strength of the oxide film. This indicates that other mechanisms, such as in-situ chemical corrosion-enhanced mechanical wear, dominate the CMP process