Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies

This paper presents the results of a research program set up to evaluate atomic layer deposition (ALD) conformal coatings as a method of mitigating the growth of tin whiskers from printed circuit board assemblies. The effect of ALD coating process variables on the ability of the coating to mitigate whisker growth were evaluated. Scanning electron microscopy and optical microscopy were used to evaluate both the size and distribution of tin whiskers and the coating/whisker interactions. Results show that the ALD process can achieve significant reductions in whisker growth and thus offers considerable potential as a reworkable whisker mitigation strategy. The effect of ALD layer thickness on whisker formation was also investigated. Studies indicate that thermal exposure during ALD processing may contribute significantly to the observed whisker mitigation

Gravure-offset printing in the manufacture of ultra-fine-line thick-films for electronics

Abstract In gravure offset printing, ink is transferred with the help of an offset material from a patterned gravure plate to a substrate. This thesis is concerned with the study and further development of this printing process for electronics; on alumina, glass and polymers. The work has been divided into five parts. In the first section, the printing process is described. The second section describes the composition of the inks for gravure offset printing and the resulting ink properties. It also presents the ink transfer mechanism; the model that explains how the ink is transferred between an offset material and a substrate. The third chapter details the printing process explained by a solvent absorption mechanism. The forth chapter describes the firing/curing of printed samples and their properties. The last chapter describes applications of the method. The inks used to produce conductors on ceramics (ceramic inks) and conductors on polymers (polymer inks) contain silver particles, and were under development for gravure offset printing. The major achieved properties were the high ink pickup to the offset blanket and high transfer percentage to the substrate. 100% ink transfer from blanket to substrate for ceramic inks and almost 100% ink transfer for polymer inks was obtained. The printing of ceramic inks was able to produce 8 μm of relatively thick, 300 μm wide lines with < 10 mΩ/sq. resistance. The minimum line width for conducting lines was 35 μm, with one printing. Multi printing was applied producing as many as 10 times wet-on-wet multiprinted lines with 100 % ink transfer from blanket to substrate resulting in a square resistance of 1mΩ/sq. Polymer inks were able produce a square resistance of 20 mΩ/sq. for 300 μm wide lines after curing at 140 °C for about 15 min, and the minimum width was down to 70 μm. In the optimised manufacturing process, the delay time on the blanket was reduced to 3 s. In addition to ultra-fine-line manufacturing of conductors, the method enables the manufacture of special structures e.g. laser-solder contact pads with 28/28 μm lines/spaces resolution. With industrial printing equipment it is possible to produce 100 m2/h with the demonstrated printing properties

Fabrication of ultrathin multilayered superomniphobic nanocoatings by liquid flame spray, atomic layer deposition, and silanization

Superomniphobic, i.e. liquid-repellent, surfaces have been an interesting area of research during recent years due to their various potential applications. However, producing such surfaces, especially on hard and resilient substrates like stainless steel, still remains challenging. We present a stepwise fabrication process of a multilayered nanocoating on a stainless steel substrate, consisting of a nanoparticle layer, a nanofilm, and a layer of silane molecules. Liquid flame spray was used to deposit a TiO2 nanoparticle layer as the bottom layer for producing a suitable surface structure. The interstitial Al2O3 nanofilm, fabricated by atomic layer deposition (ALD), stabilized the nanoparticle layer, and the topmost fluorosilane layer lowered the surface energy of the coating for enhanced omniphobicity. The coating was characterized with field emission scanning electron microscopy, focused ion beam scanning electron microscopy, x-ray photoelectron spectroscopy, contact angle (CA) and sliding angle (SA) measurements, and microscratch testing. The widely recognized requirements for superrepellency, i.e. CA > 150° and SA < 10°, were achieved for deioinized water, diiodomethane, and ethylene glycol. The mechanical stability of the coating could be varied by tuning the thickness of the ALD layer at the expense of repellency. To our knowledge, this is the thinnest superomniphobic coating reported so far, with the average thickness of about 70 nm.acceptedVersionPeer reviewe