Remote plasma sputtering for silicon solar cells

The global energy market is continuously changing due to changes in demand and fuel availability. Amongst the technologies considered as capable of fulfilling these future energy requirements, Photovoltaics (PV) are one of the most promising. Currently the majority of the PV market is fulfilled by crystalline Silicon (c-Si) solar cell technology, the so called 1st generation PV. Although c-Si technology is well established there is still a lot to be done to fully exploit its potential. The cost of the devices, and their efficiencies, must be improved to allow PV to become the energy source of the future. The surface of the c-Si device is one of the most important parts of the solar cell as the surface defines the electrical and the optical properties of the device. The surface is responsible for light reflection and charge carrier recombination. The standard surface finish is a thin film layer of silicon nitride deposited by Plasma Enhanced Chemical Vapour Deposition (PECVD). In this thesis an alternative technique of coating preparation is presented. The HiTUS sputtering tool, utilising a remote plasma source, was used to deposit the surface coating. The remote plasma source is unique for solar cells application. Sputtering is a versatile process allowing growth of different films by simply changing the target and/or the deposition atmosphere. Apart from silicon nitride, alternative materials to it were also investigated including: aluminium nitride (this was the first use of the material in solar cells) silicon carbide, and silicon carbonitride. All the materials were successfully used to prepare solar cells apart from the silicon carbide, which was not used due to too high a refractive index. Screen printed solar cells with a silicon nitride coating deposited in HiTUS were prepared with an efficiency of 15.14%. The coating was deposited without the use of silane, a hazardous precursor used in the PECVD process, and without substrate heating. The elimination of both offers potential processing advantages. By applying substrate heating it was found possible to improve the surface passivation and thus improve the spectral response of the solar cell for short wavelengths. These results show that HiTUS can deposit good quality ARC for silicon solar cells. It offers optical improvement of the ARC s properties, compared to an industrial standard, by using the DL-ARC high/low refractive index coating. This coating, unlike the silicon nitride silica stack, is applicable to encapsulated cells. The surface passivation levels obtained allowed a good blue current response

Measurement of thin film interfacial surface roughness by coherence scanning interferometry

Coherence Scanning Interferometry (CSI), which is also referred to as scanning white light interferometry, is a well-established optical method used to measure the surface roughness and topography with sub-nanometer precision. One of the challenges CSI has faced is extracting the interfacial topographies of a thin film assembly, where the thin film layers are deposited on a substrate, and each interface has its own defined roughness. What makes this analysis difficult is that the peaks of the interference signal are too close to each other to be separately identified. The Helical Complex Field (HCF) function is a topographically defined helix modulated by the electrical field reflectance, originally conceived for the measurement of thin film thickness. In this paper, we verify a new technique, which uses a first order Taylor expansion of the HCF function to determine the interfacial topographies at each pixel, so avoiding a heavy computation. The method is demonstrated on the surfaces of Silicon wafers using deposited Silica and Zirconia oxide thin films as test examples. These measurements show a reasonable agreement with those obtained by conventional CSI measurement of the bare Silicon wafer substrates

Development of ZnTe as a back contact material for thin film cadmium telluride solar cells

Cadmium telluride (CdTe) is high-efficiency commercialised thin film photovoltaic technology. However, developing a stable low-resistivity back contact to the CdTe solar cells is still an issue. High work function and low level of doping of this material don't allow to create an ohmic contact with metals directly. Copper is commonly used to lower the back contact barrier in CdTe solar cells, but an excessive amount of copper diffusing through the cell is harmful for the device performance and stability. In this work a copper-doped ZnTe (ZnTe:Cu) buffer layer was incorporated in between CdTe and gold metal contact by high-rate pulsed DC magnetron sputtering. The back contact was then activated by rapid thermal processing (RTP) resulting in spectacular improvement in key device performance indicators, open circuit voltage (VOC) and fill factor (FF)

Blistering of magnetron sputtered thin film CdTe devices

Magnetron sputtering is an industrially scalable technique for thin film deposition. It provides excellent coating uniformity and the deposition can be conducted at relatively low substrate temperatures. It is widely used in the manufacture of solar modules. However, its use for the deposition of thin film CdTe devices results in unusual problems. Blisters appear on the surface of the device and voids occur in the CdTe absorber. These problems appear after the cadmium chloride activation treatment. The voids often occur at the CdS/CdTe interface causing catastrophic delamination. This problem has been known for more than 25 years, but the mechanisms leading to blistering have not been understood. Using High Resolution Transmission Electron Microscopy we have discovered that during the activation process, argon trapped during the sputtering process diffuses in the lattice to form gas bubbles. The gas bubbles grow by agglomeration particularly at grain boundaries and at interfaces. The growth of the bubbles eventually leads to void formation and blistering

Cadmium chloride assisted re-crystallisation of CdTe: The effect on the CdS window layer

© 2015 Materials Research Society. The cadmium chloride annealing treatment is an essential step in the manufacture of efficient thin film CdTe solar cells. In previous work we have shown that the primary effect of the treatment is to remove high densities of stacking faults from the as-deposited material. Use of density functional theory has shown that some of the higher energy stacking faults are hole traps. Removal of these defects dramatically improves cell efficiency. In this study we focus on the effect of the activation treatment on the underlying n-type cadmium sulphide layer. A range of techniques has been used to observe the changes to the microstructure as well as the chemical and crystallographic changes as a function of treatment parameters. Electrical tests that link the device performance with the micro-structural properties of the cells have also been undertaken. Techniques used include High Resolution Transmission Electron Microscopy (HRTEM) for subgrain analysis, EDX for chemical analysis and XPS and SIMS for composition-depth profiling. By studying the effect of increasing the treatment time and temperature, we will show that the cadmium sulphide layer depletes to the point of complete dissolution into the absorber layer. We will also show that chlorine penetrates and decorates the grain boundaries in the cadmium sulphide. In addition we will show that chlorine builds up at the heterojunction and concentrates in voids at the cadmium telluride/cadmium sulphide interface. A combination of these effects damages the electrical performance of the solar cell

Characterization of CdTe photovoltaic devices passivated using hydrogen plasma

Thin-film polycrystalline CdTe photovoltaic devices were studied using electrical and material characterization methods to understand the effects of hydrogen plasma passivation treatment. Devices were fabricated using sublimation and were exposed to hydrogen plasma for 10, 20 and 30 minutes. Current density vs voltage measurements were performed to measure the performance of the devices. Capacitance vs voltage graphs showed that dopants are active and the device behaved like a CdCl2 passivated device. Microscopic characterization was performed using SEM and (S)TEM that showed larger grains and more homogenous film coverage as compared to films without passivation suggesting grain growth during H2 passivation