Micro-Raman and dielectric phase transition studies in antiferroelectric PbZrO3 thin films

Antiferroelectric materials are found to be good alternative material compositions for high-charge-storage devices and transducer applications. Lead zirconate (PZ) is a room-temperature antiferroelectric material. The antiferroelectric nature of PZ thin films was studied over a temperature range of 24-300°C, in terms of Raman scattering, dielectric constant, and polarization. Temperature-dependent dielectric and polarization studies indicated a nonabrupt phase transition. To alleviate the extrinsic effects influencing the phase transition behavior, Raman scattering studies were done on laser-ablated PZ thin films as a function of temperature and clear phase transformations were observed

Dielectric and ferroelectric response of sol-gel derived Pb0.85La0.15TiO3Pb_{0.85}La_{0.15}TiO{_3} ferroelectric thin films on different bottom electrodes

Sol-gel derived Pb0.85La0.15TiO3 thin films were deposited on Pt, Pt/Si, RuO2/Pt/Si and RuO2/Si bottom electrodes. The structural and microstructural characteristics of the films were studied using X-ray diffraction and atomic force microscopy techniques. Dielectric, ferroelectric and leakage current characteristics were evaluated and depth profile Auger electron spectroscopy was used to obtain direct evidence for reactivity and compositional changes at the film/electrode interface and determine their effect on the ferroelectric and dielectric properties of films. Films deposited on Pt electrode showed a relatively higher dielectric constant of approximately 1300, while the films on RuO2 exhibited lower dielectric constant of only 470. J-t characteristics with leak-age current of approximately 10(-8) A/cm(2) under low biasing field (10 kV/cm) was observed for the films under study. The steady state field dependent de conductivity was examined by the measurement of J-E characteristics. At very low fields (< 30 kV/cm) films followed ohmic behavior and was fitted with a space-charge-limited conduction mechanism in the intermediate fields (30-60 kV/cm). The on-set voltage for the non-linearity was considered as V-TFL using which, the trap concentration estimated for films on RuO2/Si electrode was 1.23 X 10(17) cm(-3). Observed current characteristics have been correlated with large interfacial resistance at the film-electrode boundary. In the case of RuO2 bottom electrodes, the dielectric and ferroelectric properties are correlated with the electrode characteristics and Si diffusion at the film-electrode interface

Structural and electrical characteristics of Pb0.90La0.15TiO3 thin films on different bottom electrodes

Pb0.90La0.15TiO3 (PLT15) thin films were deposited by the sol-gel method on Pt, Pt/Si, and RuO2 on Si and Pt/Si bottom electrodes. X-ray diffraction, micro-Raman spectroscopy, and atomic force microscopy techniques were used for structural characterization of these films. PLT15 films on different electrodes showed good surface morphology with dense and uniform microstructure. PLT15 films on solution derived RuO2 bottom electrodes show (100) preferred orientation of growth and result in larger crystallites. Films deposited on a Pt bottom electrode show sharp and intense Raman features indicating better crystallinity and insignificant film–electrode interactions. PLT15 film on a Pt bottom electrode exhibited higher dielectric constant (1300 at 100 kHz) and high values of Pm and Pr , 68 and 46 mC/cm2, respectively, compared to other electrodes. Films on a RuO2 bottom electrode showed relatively inferior dielectric and ferroelectric properties. The ac field dependence of dielectric permittivity at subswitching fields was fitted using the Rayleigh law. It was found that ~22% of the total measured permittivity was due to irreversible domain wall displacement for the films on a Pt electrode. The reversible polarization components estimated from the capacitance–voltage (C–V) and quasistatic hysteresis measurements showed that Prev /Psat at Vmax for the case of Pt/Si (24%), was larger than that of Pt (11%) bottom electrodes. The observed results were correlated with the domain wall pinning at the disturbed film–electrode interface

Electrical properties of La-graded heterostructure of Pb1?xLaxTiO3 thin films

La-graded heterostructure films were prepared by sol-gel technique on platinum substrates and electrical properties of these films were compared with those of conventional thin films of similar compositions. X-ray diffraction results indicate the pure perovskite polycrystalline structure of these films. Atomic Force Microscopy analysis revealed a finer grain size and relatively lower surface roughness. Relatively higher values of Pm and Pr (69 and 38 ?C cm?2, respectively) and excellent dielectric properties with lower loss (K=1900, tan ?=0.035 at 100 kHz) were observed for La-graded heterostructure films. Also lower leakage current density (not, vert, similar2.5 nA cm?2) and a higher onset field (not, vert, similar50 kV cm?1) of space charge conduction indicated higher breakdown strength and good leakage current characteristics. The ac electric field dependence of the permittivity at sub-switching fields was analyzed in the framework of the Rayleigh dynamics of domain walls. The estimated irreversible domain wall displacement contribution to the total dielectric permittivity was 17 and 9% for conventional 15 at.% La doped PbTiO3 and La-graded heterostructure films, respectively. The improved dielectric and polarization behavior of La-graded heterostructure films may be attributed to homogenous dopant distribution compared to the conventional 15 at.% La doped PbTiO3 films

Growth and Characterization Studies of ABi2ta2o9 (A = Ba, Sr and Ca) Ferroelectric Thin Films

Thin films of ferroelectric ABi2Ta2O9 bismuth-layered structure, where A = Ba, Sr and Ca, were prepared by pulsed laser deposition technique on Pt/TiO2/SiO2/Si(100) substrates. The influence of substrate temperature between 500 to 750°C, and oxygen partial pressure 100-300 mTorr, on the structural and electrical properties of the films was investigated. The films deposited above 650°C substrate temperature showed complete Aurivillius layered structure. Films annealed at 750°C for 1h in oxygen atmosphere have exhibited better electrical properties. Atomic force microscopy study of surface topography shows that the films grown at lower temperature has smaller grains and higher surface roughness. This paper discusses the pronounced influence of A-site cation substitution on the structural and ferroelectric properties with the aid of Raman spectroscopy, X-ray diffraction and electrical properties. The degradation of ferroelectric properties with Ba and Ca substitution at A-sites is attributed to the higher structural distortion caused by changing tolerance factor. A systematic proportionate variation of coercive field is attributed to electronegativity difference of A-site cations