95 research outputs found

    Detection of Corrosion‐Related Defects in Aluminum Using Positron Annihilation Spectroscopy

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    Near‐surface atomic‐scale defects in aluminum foils of at least 99.98% purity were characterized with positron annihilation spectroscopy measurements of the Doppler‐broadening parameter S. Profiles of S vs. positron beam energy (i.e., vs. depth into the sample) were analyzed with a model for positron diffusion and trapping in order to characterize the defect layer structure. As‐received foils were shown to possess a defect layer within 10 to 100 nm of the oxide film/metal interface. Both dissolution in aqueous sodium hydroxide solution and anodic pitting corrosion in caused significant changes in the position spectra which were interpreted as increases in the defect population. On the basis of isochronal annealing, the defects were impurity‐complexed voids or vacancy clusters, or else interfacial voids at the metal/film boundary located at surface roughness features. Either case suggests a possible role for the defects as pit sites, since both near‐surface impurities and surface roughness are known to influence the number of pits on a surface. Defects found after pitting may be present in layers surrounding individual pits, and might have been produced in the process of pit initiation

    Positron Annihilation Spectroscopy Study of Interfacial Defects Formed by Anodic Oxidation of Aluminum

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    Positron annihilation spectroscopy (PAS) measurements were carried out to characterize open-volume defects associated with anodic oxidation of aluminum. The annihilation fractions with low and high momentum electrons (S and W spectral lineshape parameters, respectively) of the annihilation photopeak were determined, as a function of the positron beam energy. A subsurface defect layer, containing nanometer-scale voids in the metal near the metal/oxide film interface, was found after oxide growth, and was shown to contain new voids created by anodizing. Such interfacial voids in the metal are of interest because of their possible role as corrosion initiation sites. The Sparameter characterizing the defect-containing layer (Sd) was obtained by simulation of the S-energy profiles. On samples with two different surface conditions, Sd remained constant at its initial value during anodizing. Because Sd is related to the void volume fraction in the interfacial metallic layer containing the voids, that result suggests that formation of metallic voids, and their subsequent incorporation into the growing oxide layer, occurred repeatedly at specific favored sites. © 2003 The Electrochemical Society. All rights reserved

    Defect Characterization in SiGe/SOI Epitaxial Semiconductors by Positron Annihilation

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    The potential of positron annihilation spectroscopy (PAS) for defect characterization at the atomic scale in semiconductors has been demonstrated in thin multilayer structures of SiGe (50 nm) grown on UTB (ultra-thin body) SOI (silicon-on-insulator). A slow positron beam was used to probe the defect profile. The SiO2/Si interface in the UTB-SOI was well characterized, and a good estimation of its depth has been obtained. The chemical analysis indicates that the interface does not contain defects, but only strongly localized charged centers. In order to promote the relaxation, the samples have been submitted to a post-growth annealing treatment in vacuum. After this treatment, it was possible to observe the modifications of the defect structure of the relaxed film. Chemical analysis of the SiGe layers suggests a prevalent trapping site surrounded by germanium atoms, presumably Si vacancies associated with misfit dislocations and threading dislocations in the SiGe films
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