156 research outputs found
Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires
Full text link
Dehydrogenation of alcohols and hydrogenation of aldehydes using homogeneous ruthenium catalysts
No full text
Preface : Materials and Technologies for 3-D Integration - 2008 MRS Fall Meeting; Boston, MA; 1 December 2008 through 3 December 2008
No full text3-dimensional integration (3D IC) is a system level architecture/technology wherein multiple layers of planar devices are stacked and vertically interconnected through the silicon substrate (or other semiconductor material) in the Z direction as shown in Figure 1
- …
