IMECE2008-66309 DEVELOPMENT OF LEAD-FREE NANOCOMPOSITE SOLDERS USING OXIDE BASED REINFORCEMENT

ABSTRACT In this study, Sn.3.5Ag/SnO 2 nanocomposite solders are developed. Composites with 0.7 and 1.0 volume percentage of tin oxide were synthesized through powder metallurgy route incorporating microwave assisted rapid sintering technique followed by hot extrusion. The extruded specimens were examined in terms of their physical and tensile properties. Tensile characterization studies revealed that 0.2% yield strength and ultimate tensile strength were increased significantly by addition of 0.7 volume percent of nano SnO 2 particles. An attempt is made to correlate mechanical properties of Sn-3.5Ag with the presence of SnO 2 particles at the nanometer length scale

IMECE2008-66308 EFFECT OF PROCESSING METHODOLOGY ON MICROSTRUCTURE AND MECHANICAL PROPERTIES OF Sn-3.5Ag SOLDER

ABSTRACT The manufacturing techniques of powder metallurgy and casting were used to synthesize a Sn-3.5Ag followed by hot extrusion. In the sintering step of powder metallurgy, two routes of conventional and microwave sintering were investigated. Physical, microstructural, thermomechanical and mechanical properties of the developed solders were examined. These studies revealed that the best combination of the properties is realized from the Sn-3.5Ag synthesized using powder metallurgy incorporating microwave sintering route. An attempt is made to correlate processingmicrostructure-properties relationship for Sn-3.5Ag. INTRODUCTION Environmental and health concerns over the use of Pb in electronic packaging have prompted the development and understanding of the behavior of Pb-free solder

Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder

10.1115/IMECE2008-66308ASME International Mechanical Engineering Congress and Exposition, Proceedings1585-8

Reinforcements at nanometer length scale and the electrical resistivity of lead-free solders

10.1016/j.jallcom.2008.11.074Journal of Alloys and Compounds4781-2458-461JALC

Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites

10.1179/174328408X378582Materials Science and Technology25101258-1264MSCT

Development of lead-free nanocomposite solders using oxide based reinforcement

10.1115/IMECE2008-66309ASME International Mechanical Engineering Congress and Exposition, Proceedings1589-9

Effects of slope plate variable and reheating on semi-solid structure of reheating on semi-solid structure of ductile cast iron

Semi-solid metal casting and forming are known as a promising process for a wide range of metal alloys production. In spite of growing application of semi-solid processed light alloys, a few works have been reported about semi-solid processing of iron and steel. In this research inclined plate was used to change dendritic structure of iron to globular one. The effects of length and slope of plate on the casting structure were examined. The results show that the process can effectively change the dendritic structure to globular. In the slope plate angle of 7.5° and length of 560 mm with cooling rate of 67Ks-1 the optimum nodular graphite and solid globular particle were achieved.The results also show that by using slope plate inoculant fading can be prevented more easily since the total time of process is rather short. In addition, the semi-solid ductile cast iron prepared by inclined plate method, was reheated to examine the effect of reheating conditions on the microstructure and coarsening kinetics of the alloy. Solid fraction at different reheating temperatures and holding time was obtained and based on these results the optimum reheating temperature range was determined

Development of lead-free Sn-3.5Ag/SnO 2 nanocomposite solders

10.1007/s10854-008-9767-1Journal of Materials Science: Materials in Electronics206571-57