3 research outputs found

    Wind Characteristics Influencing Wind Energy.

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    Usually the wind speed for a particular site is given at a standard reference height of 10 m. However, in the context of wind turbines, the hub height is a natural choice for estimating the power potential

    The Potential Of Wave And Offshore Wind Energy In Around The Coastline Of Malaysia That.Face The South China Sea.

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    The world wide estimated wave energy resource is more than 2 TW. Offshore wind speeds are generally higher than wind speeds over land, hence higher available energy resource. The estimated offshore wind potential in European waters alone is in excess of2500 TWh/annum. Offshore area also provides larger area for deploying wind energy devices. In recent year efforts to promote these two types of renewable and green energy sources have been intensify. Using the data obtained from the Malaysia Meteorological Service (MMS) analysis was conducted for the potential of wave energy and wind energy along the coastline of Malaysia facing the South China Sea. Maps of wave power potential were produced. The mean vector wind speed and direction were tabulated

    IPACK2005-73197 NUMERICAL MODEL TO ANALYSE IC CHIP ENCAPSULATION PROCESS

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    ABSTRACT In this paper, simulation of the 2D flow of incompressible molten epoxy material in a mold cavity has been carried out. Characteristic Based Split (CBS) was used in its semi-implicit form to analyze the mold filling behavior in underfilling encapsulation process. A two dimensional numerical model was developed and the governing equations were solved by using Characteristic Based Split (CBS) method to get the velocity and pressure fields. The velocity filed was used in pseudo-concentration approach to track the flow front. Pseudoconcentration is based on the Volume of Fluid (VOF) technique and was used to track fluid front for each time step. Simulation has been carried out for a particular geometry of a flip-chip package. The model proposed could provide a means to simulate the underfilling process for flip chip package
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