Local electrochemical deposition of Ni into vertical vias in Si/SiO2 substrate

Ni electrochemical deposition into a matrix of various diameters (500–2000 nm) vertical vias in Si/SiO2 substrates with a barrier layer at the vias’ bottom has been investigated. Morphological study of Ni deposits in the vias showed they are deposited directly on the surface of the barrier layer. Repeatability and stability in combination with a homogeneous structure and 70% filling degree of vias determine the prospects of the Si/SiO2/Ni system as a basic element for the creation of three-dimensional micro-, nanostructures, and 3D assembly of IC crystals

Study of the Thermal Stability of Copper Contact Junctions in Si/SiO2 Substrates

The results of a comprehensive study of the structural- morphological and thermodynamic characteristics of the electrochemical precipitation of Cu in transition holes with a barrier layer of TiN in Si/SiO2 substrates by scanning electron microscopy (SEM) and differential thermal analysis (DTA) are presented. The temperature range that determines the heat resistance of copper (up to 750°C) and the temperature range (up to 886°C) that determines the thermal stability of the composite as a whole, as well as the ability to maintain the chemical composition and ordered structure at elevated temperatures, are found

Metallization of Vias in Silicon Wafers to Produce Three-Dimensional Microstructures

The processes of electrochemical deposition into a matrix of vertical vias of different diameters (500–2000 nm) in Si/SiO2 substrates with a TiN barrier layer at the bottom of the holes are studied. Morpho- logical studies of the metal in the holes show that the structure of copper clusters is rather uniform and is formed from crystallites of ~30 to 50 nm. Repeatability and stability with a homogeneous structure and with holes filled 100% by Cu determine the prospect of using the Si/SiO2/Cu system as a basic element for creating three-dimensional micro- and nanostructures, as well as for the 3D assembly of IC crystals

A Study of Ta2O5 Nanopillars with Ni Tips Prepared by Porous Anodic Alumina Through-Mask Anodization

The paper discusses the formation of Ta2O5 pillars with Ni tips during thin porous anodic alumina through-mask anodization on Si/SiO2 substrates. The tantalum nanopillars were formed through porous masks in electrolytes of phosphoric and oxalic acid. The Ni tips on the Ta2O5 pillars were formed via vacuum evaporation through the porous mask. The morphology, structure, and magnetic properties at 4.2 and 300 K of the Ta2O5 nanopillars with Ni tips have been studied using scanning electron microscopy, X-ray diffraction, and vibrating sample magnetometry. The main mechanism of the formation of the Ta2O5 pillars during through-mask anodization was revealed. The superparamagnetic behavior of the magnetic hysteresis loop of the Ta2O5 nanopillars with Ni tips was observed. Such nanostructures can be used to develop novel functional nanomaterials for magnetic, electronic, biomedical, and optical nano-scale devices

Nickel/alumina nanocomposites by AC electrochemical processing

Nanowire/pillar composite fabricated by alternating current electrochemical deposition of nickel into/onto thin porous anodic alumina (PAA) is investigated for magnetosensitive medium applications. Magnetization and current transport features of Ni nanowires/porous matrix composite in the current-perpendicular-to-plane mode are considered. Fabrication processing features, SEM characterization results are presented. PAA/Ni nanocomposite with Ni nanoparticles of 15–25 nm characteristic size is formed at initial stages of deposition. Continuous Ni nanowires/nanotubes composites are formed over the whole alumina pores depth after ~10-min deposition. XRD analysis confirms the polycrystalline nature of Ni nanowires with [111] preferential orientation

SnSx – based nanostructured layers for solar cells

SnSx – based nanostructuredthin films and photocells thereof fabricated by chemical processing were investigated/ Optical absorbtion characteristics of single-layer SnS2 and double-layer SnSx/ SnS2 composites have been studied demonstrating Eg~2.1 to 2.9 eV due to ~10 nm nanograins morphology/ The test SnSx/Zno photocells have been fabricated and tested showing the conversion efficiency ~1.6%

Study of metal pillar nanostructure formation with thin porous alumina template

In the present paper, the nickel pillared nanostructure fabrication by electrochemical deposition of Ni into the pores of thin porous anodic alumina is considered. The main characteristics of these structures, obtained by scanning electron microscopy and atomic-force microscopy, are presented. Information on geometrical parameters of porous host and pillar nanostructure elements has been obtained. The influence of the barrier layer thinning at the pore bottom on nucleation and growth of the ordered metal nanopillars is discussed. The process of functional layer formation based on thin aluminum and Al2O3 films with incorporated nickel pillars is analyzed. This process may be used for fabrication of advanced high density magnetic memory devices

Nickel/alumina nanocomposites by AC electrochemical processing

Nanowire/pillar composite fabricated by alternating current electrochemical deposition of nickel into/onto thin porous anodic alumina (PAA) is investigated for magnetosensitive medium applications. Magnetization and current transport features of Ni nanowires/porous matrix composite in the current-perpendicular-to-plane mode are considered. Fabrication processing features, SEM characterization results are presented. PAA/Ni nanocomposite with Ni nanoparticles of 15–25 nm characteristic size is formed at initial stages of deposition. Continuous Ni nanowires/nanotubes composites are formed over the whole alumina pores depth after ~10-min deposition. XRD analysis confirms the polycrystalline nature of Ni nanowires with [111] preferential orientation

The features of Ni-Fe nanowires electrochemical deposition into porous alumina template

The arrays of numerous metallic nanowires (NWs) with straight-ordered configuration have attracted a lot of attention due to their shape anisotropy and extremely large surface area. The combination of this unique structure with uncommon magnetic, optical and transport properties can be used to develop novel functional nanomaterials for magnetic, electronic, biomedical and optical nano-scale devices [1, 2]

Highly ordered through-holes Porous alumina membranes for Ni-Fe nanowires fabrication

Free-standing through-pores alumina membranes of 30–90 µm thickness and 70 × 70 mm size have been fabricated to deposit Ni–Fe nanowires by electrochemical processing. Ni–15%Fe nanowires were deposited locally into the membranes. Due to highly ordered microstructure of the membranes, the pores were filled by nanowires almost to 100%. The membrane nanowires composite morphology; structure and chemical features have been studied by scanning electron microscopy, X-ray structural analysis and X-ray energy-dispersive spectroscopy. The anomalous Fe deposition effect was observed at the initial stage of Ni–Fe composite deposition into narrow channels of porous alumina. Furthermore, deposition process is being stabilized, and constant chemical composition nanowires are formed