9 research outputs found
A 2nd order discretization of imperfect contact problems with piecewise constant coefficients on cell-centred grids
No full textNonequilibrium Diamond Growth during the High-Temperature High-Pressure Synthesis of a Composite Material Made of a Mixture of Cobalt and Fullerene Powders
No full textOptimization of Steel-Surface Hardening by Carbon Nanostructures Followed by Treatment with High-Intensity Energy Sources
No full textEffect of pressure on the formation of superelastic hard particles in a metal-fullerene system and the tribological properties of composite materials reinforced with such particles
No full textPhase Transformations in C60 Fullerene with Iron and Aluminum at High Pressures and Temperatures
No full textStructure and properties of the superelastic and hard carbon particles reinforcing wear-resistant composite materials obtained from mixtures of iron and fullerene powders under pressure
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Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles
No full textThis paper is in closed access.In this work, SAC305 lead-free solder reinforced with 0.1 wt. % fullerene nanoparticles was prepared using a powder metallurgy method. A lab-made setup and a corresponding Cu/solder/Cu sample for thermo-migration (TM) test were designed and implemented. The feasibility of this setup for TM stressing was further verified with experimental and simulation methods; a temperature gradient in a solder seam was calculated as 1070 K/cm. Microstructural evolution and mechanical properties of both plain and composite solder alloys were then studied under the condition of TM stressing. It was shown that compared to unreinforced SAC305 solder, the process of diffusion of Cu atoms in the composite solder seam was remarkably suppressed. After the TM test for 600 h, Cu/solder interfaces in the composite solder seam were more stable and the inner structure remained more intact. Moreover, the addition of fullerene reinforcement can considerably affect a distribution of Cu6Sn5 formed as a result of dissolution of Cu atoms during the TM test. Hardness data across the solder seam were also found notably different because of the elemental redistribution caused by TM
