15 research outputs found

    Enhancement on wettability and intermetallic compound formation with an addition of Al on Sn-0.7Cu lead-free solder fabricated via powder metallurgy method

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    Due to the toxicity of lead (Pb), the exploration of another possibility for lead-free solder is necessary. Nowadays, SnCu alloys are being established as one of the lead-free solder alternatives. In this study, Sn-0.7Cu lead-free solder with an addition of 1wt% and 5wt% Al were investigated by using powder metallurgy method. The effect of Al addition on the wettability and intermetallic compound thickness (IMC) of Sn-0.7Cu-Al lead-free solder were appraised. Results showed that Al having a high potential to enhance Sn-0.7Cu lead-free solder due to its good wetting and reduction of IMC thickness. The contact angle and IMC of the Sn-0.7Cu-Al lead-free solder were decreased by 14.32% and 40% as the Al content increased from 1 wt% to 5 wt%

    Development of low cost Sn-0. 7Cu base composite solder for high temperature application

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    This research has investigated the advantages of Sn-0. 7Cu composite solder compared to conventional Sn-0. 7Cu solder. The method used for fabricating the composite solder is a powder metallurgy (PM) technique. SiC and Al particles were added to Sn-0. 7Cu powder during the mixing process. The Sn-0. 7Cu solder composite that reinforced with 0. 25 wt% of SiC and 0. 5 wt% of Al, were successfully synthesized via PM technique. The result showed that the addition of SiC and Al were improving the mechanical properties and thermal stability of the solder as well as reduces the material cost

    The effects of zinc addition on the microstructure, melting point and microhardness of Sn-0.7Cu lead-free solder fabricated via powder metallurgy method

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    The attempt to produce various types of lead-free solder has been actively investigated around the world in order to substitute the harmful SnPb solders. The effects of Zn addition on the microstructure, melting point and microhardness of Sn-0.7Cu lead-free solder were investigated with 1 wt% and 5 wt% of Zn additions. Powder metallurgy (PM) method was used to fabricate these Sn-0.7Cu-Zn lead-free solders. The results revealed that the addition of Zn was able to improve the solder properties. The melting point of Sn-0.7Cu-Zn lead-free solder was decreased drastically as the increasing of Zn additions. The Zn particles were distributed homogenously along the grain boundaries and produced refined dendrite β-Sn, which also lead to a superior microhardness values of solders

    Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates

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    CuSn is the most common intermetallic compound (IMC) in lead-free solder joints, and is also a promising anode material for advanced lithium-ion batteries. It has been reported that the growth rates of (Cu,Ni)Sn in Sn-based solder alloy/Cu-xNi substrate couples are greatly accelerated compared to the intermetallic layers that form on a pure Cu substrate. Due to the faster growth rates, solidification can progress through a transient-liquid-phase reaction in commercially relevant timeframes. The complete reaction of the liquid Sn in the couple will result in a joint that is stable at high temperatures. Furthermore, the presence of Ni in the intermetallic suppresses the formation of a CuSn layer and stabilises the (Cu,Ni)Sn preventing a polymorphic transformation on cooling along with the associated induced strains. This study investigates the growth rates of (Cu,Ni)Sn in Sn/Cu-xNi couples, where

    Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates

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    The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt. % Bi was added into Sn-0.7Cu and fabricated using the casting process. The result shows that the influence of 1.5 wt. % Bi in the Sn-0.7Cu solder soldered on copper organic solderability preservative (Cu-OSP) and immersion tin (Im-Sn) surface finish has improved the wettability and microhardness. Subsequently, the IMC thickness of Sn-0.7Cu+1.5Bi solder alloy on Im-Sn surface finish gives a better result than reflowed on Cu-OSP. Generally, with the addition of 1.5 wt. % Bi in Sn-0.7Cu solder alloy reflowed on the Im-Sn surface finish had enhanced the performance in terms of wettability, thickness of IMC and microhardness properties compared to on Cu-OSP surface finish

    Physical properties of Sn-3.0Ag-0.5Cu lead-free solder with the additional of SiC particles

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    Composite solder has gained researcher's attention due to its promising improvement in physical and mechanical properties for lead-free solder. To improve the properties of Sn-3.0Ag-0.5Cu (SAC) with the promising lead-free candidate, addition of silicon carbide (SiC) as a reinforcement was used in this study. This study was carried out to identify the effect of SiC particle on microstructure evolution and physical properties of SAC based solder alloys. SAC-SiC composite solder was synthesized by powder metallurgy method (PM), which consists of several processes such as mechanical blending, compaction and sintering. Three different weight percentages of SiC particles; 0.00, 0.50, and 1.00 were mechanically blended with SAC lead-free solder. The results show that the additional of particle SiC was able to refine the microstructure and reduced the size of β-Sn
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