Development of low cost Sn-0. 7Cu base composite solder for high temperature application

This research has investigated the advantages of Sn-0. 7Cu composite solder compared to conventional Sn-0. 7Cu solder. The method used for fabricating the composite solder is a powder metallurgy (PM) technique. SiC and Al particles were added to Sn-0. 7Cu powder during the mixing process. The Sn-0. 7Cu solder composite that reinforced with 0. 25 wt% of SiC and 0. 5 wt% of Al, were successfully synthesized via PM technique. The result showed that the addition of SiC and Al were improving the mechanical properties and thermal stability of the solder as well as reduces the material cost

The effects of zinc addition on the microstructure, melting point and microhardness of Sn-0.7Cu lead-free solder fabricated via powder metallurgy method

The attempt to produce various types of lead-free solder has been actively investigated around the world in order to substitute the harmful SnPb solders. The effects of Zn addition on the microstructure, melting point and microhardness of Sn-0.7Cu lead-free solder were investigated with 1 wt% and 5 wt% of Zn additions. Powder metallurgy (PM) method was used to fabricate these Sn-0.7Cu-Zn lead-free solders. The results revealed that the addition of Zn was able to improve the solder properties. The melting point of Sn-0.7Cu-Zn lead-free solder was decreased drastically as the increasing of Zn additions. The Zn particles were distributed homogenously along the grain boundaries and produced refined dendrite β-Sn, which also lead to a superior microhardness values of solders

Enhancement on wettability and intermetallic compound formation with an addition of Al on Sn-0.7Cu lead-free solder fabricated via powder metallurgy method

Due to the toxicity of lead (Pb), the exploration of another possibility for lead-free solder is necessary. Nowadays, SnCu alloys are being established as one of the lead-free solder alternatives. In this study, Sn-0.7Cu lead-free solder with an addition of 1wt% and 5wt% Al were investigated by using powder metallurgy method. The effect of Al addition on the wettability and intermetallic compound thickness (IMC) of Sn-0.7Cu-Al lead-free solder were appraised. Results showed that Al having a high potential to enhance Sn-0.7Cu lead-free solder due to its good wetting and reduction of IMC thickness. The contact angle and IMC of the Sn-0.7Cu-Al lead-free solder were decreased by 14.32% and 40% as the Al content increased from 1 wt% to 5 wt%