The usage of computer-aided cooling curve thermal analysis to optimise eutectic refiner and modifier in Al-Si alloys

Bismuth, antimony and strontium concentrations were optimised to alter the eutectic Al-Si phase in a commercial Al-Si-Cu-Mg alloy by way of computer-aided cooling curve thermal analysis. The results show that the eutectic growth temperature shifted to lower temperatures for all three inoculants. However, addition of Sr resulted in more depression of growth temperature compared with Bi and Sb. No further significant changes were observed with increasing the concentrations to more than 1, 0.5 and 0.04 wt% of Bi, Sb and Sr, respectively. The recalescence of these concentrations, meanwhile, showed a significant increase of magnitude. A good correlation was found between the results of thermal and microstructural analysis. For Bi and Sb, the eutectic depression temperature can be used as an individual criterion to gauge optimal levels of content in the refinement of Si, whereas for Sr, both depression temperature and recalescence magnitude must be considered. Based on the observed depression in eutectic growth temperature and recalescence, it can be concluded that the optimal concentrations to refine the eutectic Al-Si phase with Bi and Sb and to modify it with Sr at the given solidification conditions were 1, 0.5 and 0.04 wt%, respectively

Influence of Bi addition on wettability and mechanical properties of Sn-0.7Cu solder alloy

The effect of bismuth (Bi) micro-alloying additions on wettability and mechanical properties of Sn-0.7Cu lead-free solder were explored. This paper also investigates the influences of various Bi percentages on the suppression of intermetallic compound formation. Scanning electron microscope (SEM) was used to observe the microstructure evolution of solder joint including the thickness of interfacial intermetallic layers. Overall, with the addition of Bi to Sn-0.7Cu solder, the size of primary CuSnbecome smaller and suppresses the thickness of interfacial intermetallic compound between solder and the Cu substrate. Microhardness value and wetting properties also increased with Bi addition which resulted in smaller size of β-Sn and CuSn

Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste

The feasibility of the highly reliable and replicable microstructure formation of the transient liquid phase sintering (TLPS) paste during the early soldering and isothermal aging on the Cu substrate had been successfully investigated in this study. By using the Sn–0.7 wt% Cu (SC) solder paste as the base material and the Cu particles in the production of the TLPS Sn–10 wt% Cu (SC10) solder paste, the ensuing CuSn phase from the isothermal aging process was found to have reduced the β-Sn area of the bulk SC10 solder microstructure. The growth kinetic for TLPS SC10 resulted in a 26.76\ua0kJ/mol of activation energy level. The real-time synchrotron\ua0radiation imaging technique that was employed in studying the growth and formation of the primary intermetallic phases at the solder joints had also discovered the primary intermetallic in TLPS SC10 was not only found to have experienced an early nucleation just after the solder had melted, but its growth was also restricted prior to the solidification of the liquid solder. Therefore, the relevance of the results that were obtained from this research may offer a possible solution for aiding the future development of highly reliable solder joints in high temperature solder applications

The influence of strontium on porosity formation in Al-Si alloys

Strontium modification is known to alter the amount, characteristics, and distribution of porosity in Al-Si castings. Although many theories have been proposed to account for these effects, most can be considered inadequate because of their failure to resolve contradictions and discrepancies in the literature. In an attempt to critically appraise some of these theories, the amount, distribution, and morphology of porosity were examined in sand-cast plates of Sr-free and Sr-containing pure Al, Al-l wt pet Si, and Al-9 wt pet Si alloys. Statistical significance testing was used to verify apparent trends in the porosity data. No apparent differences in the amount, distribution, and morphology of porosity were observed between Sr-free and Sr-containing alloys with no or very small eutectic volume fractions. However, Sr modification significantly changed the amount, distribution, and morphology of porosity in alloys with a significant volume fraction of eutectic. ne addition of Sr reduced porosity in the hot spot region of the casting, and the pores became well dispersed and rounded. This result can be explained by considering the combined effect of the casting design and the differences in the pattern of eutectic solidification between unmodified and Sr-modified alloys