Pure Space-Charge-Limited Electron Current in Silicon

Phosphorus diffusion on π‐type silicon is used to fabricate n^+πn^+ structures of base widths between 3 μ and 60 μ with π‐type resistivities of 300 Ω⋅cm and 8 kΩ⋅cm. The V‐I characteristics of the structures are measured at room temperature and at liquid‐nitrogen temperature. The change in current for constant applied voltage is also observed in that temperature range. The results are interpreted in terms of simple models based on the assumption that pure space‐charge‐limited current of electrons is present. The models describe well the characteristics measured on 300‐Ω⋅cm samples, except for the range of small biases on the thinnest samples. It is concluded that the drift velocity of electrons at 78°K tends towards saturation at 1.0×10^7 cm∕sec ± 10%. The current observed at this temperature actually reaches this value. The critical electric field at 78°K is 10^3 V∕cm±30% but the meaning of this concept for electrons in silicon is vague. The temperature dependence of the current at fixed bias voltages is in general agreement with the variation of the low field mobility. Results obtained on 8‐kΩ⋅cm samples need clarification. Effects of breakdown and trapping are not observed

Thermal reaction of Pt film with 110 GaN epilayer

Backscattering spectrometry, x-ray diffractometry, and scanning electron microscopy have been used to study the reaction of a thin Pt film with an epilayer of [110] GaN on [110] sapphire upon annealing at 450, 550, 650, 750, and 800 degrees C for 30 min. A Ga concentration of 2 at. % is detected by MeV He-4(++) backscattering spectrometry in the Pt layer at 550 degrees C. By x-ray diffraction, structural changes are observed already at 450 degrees C. At 650 OC, textured Ga2Pt appears as reaction product. The surface morphology exhibits instabilities by the formation of blisters at 650 degrees C and voids at 800 degrees C

Radioactive silicon as a marker in thin-film silicide formation

A new technique using radioactive 31Si (half-life =2.62 h), formed in a nuclear reactor, as a marker for studying silicide formation is described. A few hundred angstroms of radioactive silicon is first deposited onto the silicon substrate, followed immediately by the deposition of a few thousand angstroms of the metal. When the sample is heated, a silicide is first formed with the radioactive silicon. Upon further silicide formation, this band of radioactive silicide can move to the surface of the sample if silicide formation takes place by diffusion of the metal or by silicon substitutional and/or vacancy diffusion. However, if the band of radioactive silicide stays at the silicon substrate interface it can be concluded that silicon diffuses by interstitial and/or grain-boundary diffusion. This technique was tested by studying the formation of Ni2Si on silicon at 330 °C. From a combination of ion-beam sputtering, radioactivity measurement, and Rutherford backscattering it is found that the band of radioactive silicide moves to the surface of the sample during silicide formation. From these results, implanted noble-gas marker studies and the rate dependence of Ni2Si growth on grain size, it is concluded that nickel is the dominant diffusing species during Ni2Si formation, and that it moves by grain-boundary diffusion

Dissociation mechanism for solid-phase epitaxy of silicon in the Si <100>/Pd2Si/Si (amorphous) system

Solid-phase epitaxial growth (SPEG) of silicon was investigated by a tracer technique using radioactive 31Si formed by neutron activation in a nuclear reactor. After depositing Pd and Si onto activated single-crystal silicon substrates, Pd2Si was formed with about equal amounts of radioactive and nonradioactive Si during heating at 400 °C for 5 min. After an 1-sec annealing stage (450-->500 °C in 1 h) this silicide layer, which moves to the top of the sample during SPEG, is etched off with aqua regia. From the absence of radioactive 31Si in the etch, it is concluded that SPEG takes place by a dissociation mechanism rather than by diffusion

Sequence of phase formation in planar metal-Si reaction couples

A correlation is found between the sequence of phase formation in thin-film metal-Si interactions and the bulk equilibrium phase diagram. After formation of the first silicide phase, which generally follows the rule proposed by Walser and Bené, the next phase formed at the interface between the first phase and the remaining element (Si or metal) is the nearest congruently melting compound richer in the unreacted element. If the compounds between the first phase and the remaining element are all noncongruently melting compounds (such as peritectic or peritectoid phases), the next phase formed is that with the smallest temperature difference between the liquidus curve and the peritectic (or peritectoid) point

A structure marker study for Pd_2Si formation: Pd moves in epitaxial Pd_2Si

A sample with the configuration Si (111)/single crystalline Pd_2Si/polycrystalline Pd_2Si/Pd is used to study the dominant moving species during subsequent Pd_2Si formation by annealing at 275 °C. The interface between monocrystalline and polycrystalline Pd_2Si is used as a marker to monitor the dominant moving species. The result shows that Pd is the dominant moving species in the monocrystal

Ti and V layers retard interaction between Al films and polycrystalline Si

Fine-grained polycrystalline Si (poly Si) in contact with Al films recrystallizes at temperatures well below the Si-Al eutectic (577 °C). We show that this interaction can be deferred or suppressed by placing a buffer layer of Ti or V between the Al film and the poly Si. During annealing, Ti or V form TiAl3 or Val3 at the buffer-layer–Al-film interface, but do not react with the poly Si so that the integrity of the poly Si is preserved as long as some unreacted Ti or V remains. The reaction between the Ti or V layer and the Al film is transport limited ([proportional]t^1/2) and characterized by the diffusion constants 1.5×10^15 exp(–1.8eV/kT) Å^2/sec or 8.4×10^12 exp(–1.7eV/kT) Å^2/sec, respectively

Structural difference rule for amorphous alloy formation by ion mixing

We formulate a rule which establishes a sufficient condition that an amorphous binary alloy will be formed by ion mixing of multilayered samples when the two constituent metals are of different crystalline structure, regardless of their atomic sizes and electronegativities. The rule is supported by the experimental results we have obtained on six selected binary metal systems, as well as by the previous data reported in the literature. The amorphization mechanism is discussed in terms of the competition between two different structures resulting in frustration of the crystallization process

Kinetics and moving species during Co2Si formation by rapid thermal annealing

We have investigated the growth kinetics and identified the moving species during Co2Si formation by rapid thermal annealing (RTA). For the kinetics study, samples which consisted of a thin Co film on an evaporated Si substrate were used. To study which species moves, samples imbedded with two very thin Ta markers were employed. Upon RTA, only one silicide phase, Co2Si, was observed to grow before all Co was consumed. The square root of time dependence and the activation energy of about 2.1±0.2 eV were observed during the Co2Si formation up to 680 °C. The marker study indicated that Co is the dominant mobile species during Co2Si formation by RTA. We conclude that Co2Si grows by the same mechanisms during RTA and conventional thermal annealing

Instability of Amorphous Ru-Si-O Thin Films under Thermal Oxidation

Ternary films about 200 nm thick of composition Ru20Si15O65 have been synthesized by reactive rf magnetron sputtering of a Ru1Si1 target in an argon-oxygen gas. As-deposited, the films are X-ray-amorphous. Their atomic density is 8.9 × 10^22/cm^3 (5.1 g/cm^3), and their electrical resistivity is in the range of 2 mOmega cm. After annealing in dry oxygen at 600°C for 30 min, micron-sized grains of RuO2 grow out of the film and volatile RuO4 escapes. The significance of these results is discussed