Effect of the position of parallelogram ribs in micro channel on heat transfer using diamond nanoparticles

In the present work, we have studied numerically three dimensions, the impact of the position of parallelogram ribs in a micro-channel on thermal exchange. In this study, we proposed three cases of micro-channel heat sinks with parallelogram ribs. As well as one case without ribs, in each of the three cases, we varied the parallelogram rib positions on the micro-channel. The main purpose of this study is to find the best position for parallelograms ribs in which the heat dissipation is useful for improving the thermal performance of the micro-channel as well as improving the cooling of electronic components. We have chosen silicon micro-channel drains for four cases. Constant heat flux is applied to the bottom surfaces and using a nanofluid diamond-water with 5% volume concentration of diamond nanoparticle as a coolant. The simulation has been carried out using the commercial software ANSYS-Fluent. Reynolds number (Re) has been taken between 200 and 400 with the corresponding inlet velocity from 1.53 m/s to 3.01 m/s, and the flow regime has been assumed to be stationary. The numerical results show that the parallelogram ribs position of the micro-channel in the second case gave an improvement in heat exchange, where the Nusselt number is higher than in the other cases, and showed a reduction in the temperature of the heated bottom wall compared to the other cases. Also, the micro-channel shape in the second case can be used to cool the electronic components. The results also showed that with increasing Reynolds number (Re), the friction factor of the micro-channel decreases in all cases. At the same time, we find the lowest value of the thermal resistance in the second case and the biggest value in the first case, base micro-channel without ribs

Abstracts of 1st International Conference on Computational & Applied Physics

This book contains the abstracts of the papers presented at the International Conference on Computational & Applied Physics (ICCAP’2021) Organized by the Surfaces, Interfaces and Thin Films Laboratory (LASICOM), Department of Physics, Faculty of Science, University Saad Dahleb Blida 1, Algeria, held on 26–28 September 2021. The Conference had a variety of Plenary Lectures, Oral sessions, and E-Poster Presentations. Conference Title: 1st International Conference on Computational & Applied PhysicsConference Acronym: ICCAP’2021Conference Date: 26–28 September 2021Conference Location: Online (Virtual Conference)Conference Organizer: Surfaces, Interfaces, and Thin Films Laboratory (LASICOM), Department of Physics, Faculty of Science, University Saad Dahleb Blida 1, Algeria