Self-Assembly for Integration of Microscale Thermoelectric Coolers

Optimum thermoelectric cooling (TEC) solutions often require the integration of component sizes inaccessible by common manufacturing techniques such as thin-film processing and robotic assembly. This work considers an application case in which small elements (100 μm to 300 μm thick) are optimal. A capillary self-assembly process is presented as a potential route to manufacturing TECs in these size ranges. A millimeter-scale demonstration of the assembly concept is presented and Monte Carlo simulation is used to study the scaling of the self-assembly approach to assemblies with more components. While assembly rate and system yield can be a challenge, several approaches are presented for increasing both rate and yield

Analysis of rain erosion of coated materials

http://deepblue.lib.umich.edu/bitstream/2027.42/7752/5/bad2296.0001.001.pdfhttp://deepblue.lib.umich.edu/bitstream/2027.42/7752/4/bad2296.0001.001.tx