Characterization of G.C.A. Wafertrac 9000 using Kodak Micro Positive 820 Resist and Developer ZX-934

A static coating program and a spray/static development program were developed, for use on the Wafertrac 9000 using Kodak Micro Positive 820 resist and developer ZX-934 in order to minimize critical dimension shift and maximize process latitude. By maximizing process latitude, a greater tolerance for process and equipment errors can be achieved. Using the established process, 1.2µm resist lines were produced and critical dimension shift was minimized providing a process with wide process latitude for creating photoresist geometries with dimensions larger than 1.2µm