17 research outputs found
Effect of trace sodium on high temperature embrittlement in quasi-static and impact deformation of Al–5 mass% Mg alloys
No full textSources of a trace amount of sodium, and its effect on hot ductility of an Al-5 mass%Mg alloy.
No full textEffects of Heating Rate, Holding Temperature and Holding Time on Porosity and Pore Morphology of Aluminum Foams Fabricated by Powder Metallurgy Process
No full textCreep Characterization of Aluminum-Magnesium Solid-Solution Alloy through Self-Similar Microindentation
No full textInterPack2003-35165 ISOTHERMAL SHEAR FATIGUE LIFE OF Sn-xAg-0.5Cu FLIP CHIP INTERCONNECTS
No full textABSTRACT The mechanical shear fatigue test has been performed to look for the effect of silver content on the fatigue properties of Sn-xAg-0.5Cu (x=1, 2, 3 and 4) flip chip interconnections. As the strength of the solder alloy increases with increasing silver content, the increase in silver content results in preventing a shear plastic deformation of solder bump. Therefore, the flip chip joints made using higher silver content solder such as 3 and 4Ag exhibit longer fatigue life, if the same levels of displacement is applied. The fatigue ductility of the solder decreases with increasing the silver content. Therefore, the fatigue endurance of the 1Ag solder itself is superior to other solders in high plastic strain regime, even though the strength of the solder is the lowest in the solders tested. Based on this study, the 3Ag solder might exhibit good fatigue performance for all condition, and the 1Ag solder is optimum for severe strain condition
Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X=Bi or Cu) alloy by strain range partitioning approach
No full textThe constitutive creep equation for a eutectic Sn-Ag alloy using the modified theta-projection concept
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