Impact of 3D design choices on manufacturing cost

\u3cbr/\u3eThe available options in 3D IC design and manufacturing have different impact on the cost of a 3D System-on-Chip. Using the 3D cost model developed at IMEC, the cost of different system integration options is analyzed and the cost effectiveness of different technology solutions is demonstrated. The cost model is based on the IMEC 3D integration process flows and includes the cost of manufacturing equipment, fabrication facilities, personnel, and materials. Using the IMEC 3D cost model, the cost of various 3D stacking strategies is compared to single die (i.e. 2D) integration. In addition, the effect on cost of different Through-Silicon-Via (TSV) manufacturing technologies is evaluated. The effectiveness of different 3D testing strategies and their impact on system cost is also investigated

The Role of Insurability and Insurance

info:eu-repo/semantics/publishe

High density and high-bandwidth chip-to-chip connections with 20μm pitch flip-flop chip on fan-out wafer level package

Various Fan-Out Wafer Level Packaging (FO-WLP) approaches have been developed and established over the past years to answer the increasing need for high data rates, wide I/O count and the demand for increase function integration on package. Imec has been working on a novel 300mm FO-WLP concept that enables 20μm pitch interconnect density: Flip-Chip on FO-WLP. Major challenges and solutions are reported in this paper. Results demonstrate die placement alignment of < 3μm, which is suitable to allow stacking for high density interconnect. Connections between the assembled dies were intact before and after molding

High density and high-bandwidth chip-to-chip connections with 20μm pitch flip-flop chip on fan-out wafer level package

\u3cp\u3eVarious Fan-Out Wafer Level Packaging (FO-WLP) approaches have been developed and established over the past years to answer the increasing need for high data rates, wide I/O count and the demand for increase function integration on package. Imec has been working on a novel 300mm FO-WLP concept that enables 20μm pitch interconnect density: Flip-Chip on FO-WLP. Major challenges and solutions are reported in this paper. Results demonstrate die placement alignment of &lt; 3μm, which is suitable to allow stacking for high density interconnect. Connections between the assembled dies were intact before and after molding.\u3c/p\u3

Cost components for 3D system integration

\u3cp\u3eThe cost of 3D process flows is one of the most important aspects for the broader adoption of 3D integration by the semiconductor industry. In this paper the processing cost of the features and components that enable 3D stacking is considered and compared. Different stacking approaches are considered: D2W, W2W and interposer-based stacking. Furthermore, the impact of processing yield and pre-stack testing is evaluated when considering the system integration cost for each one of the 3D stacking methods. In addition the size of the stacked active dies is parameterized and the effect on the system integration cost is explored. Also, the impact of pre-stack testing on interposer in relation to processing yield and the size of the stacked active dies is investigated.\u3c/p\u3