Comparison of Field-To-Line Coupling Models: Coupled Transmission Lines Model versus Single-cell Corrected Taylor Model

International audienceModels for field-to-line coupling are interesting be- cause they help to predict the immunity of PCBs and explain the relation between routing and immunity. In this article a meandered PCB trace illuminated by EM field in a TEM cell is analysed. The near-end and far-end coupling is predicted using two models: a detailed and an approximative one. The detailed model is a circuit of coupled multi-conductor transmission lines evaluated with a circuit simulator. The approximative model consists of a single Taylor cell with an analytical modification evaluated using a numerical computing tool. Both predictions are compared with measurements and turn out to be equally precise. The advantage of the coupled lines model is its flexibility, the advantage of the modified Taylor model is its ease of use

Modeliranje pakiranja integriranih sklopova i elektromagnetske sprege s prospojnim linijama

In recent years, due to an increasing level of electromagnetic (EM) pollution, the electronic circuits are confronting rising demands on electromagnetic compatibility (EMC). Since EMC has become one of the major causes of printed circuit board (PCB) and integrated circuit redesign, the prediction of the EM field interference is of great importance. Standardized EMC tests enable the assessment of the compliance of electronic circuits to the imposed norms. Inability of the electronic circuit to comply with the standards may result in significant increase of production cost and time to market. The goal of this research is to enable circuit simulations of EMC pre-compliance tests of critical elements of electronic circuits, i.e. interconnects. The development of circuit models of the EM coupling to interconnects enables identification of possible radiated EMC issues during the circuit design flow and consequently decrease the production cost and increase system reliability. The TEM cell and IC-Stripline present the standard methods for the radiated emission and immunity pre-compliance EMC tests. In this work, the TEM cell and IC-Stripline equivalent circuit models are developed as well as the circuit models of EM field coupling to the printed circuit board traces. The interconnects considered in this work are IC packages and transmission lines. The response surface methodology based on EM simulations is used to build scalable circuit models of IC packages. The broadband modelling of SMA connectors and transmission lines is performed. The accuracy of the developed circuit models is very good and the models present a significant step towards reliable circuit simulations of the complex electronic system pre-compliance EMC tests.Današnji elektronički sklopovi imaju stroge kriterije za elektromagnetsku (EM) kompatibilnost pa je stoga od velikog značaja mogućnost predviđanja sprege EM polja s elementima elektroničkog sklopa. Standardizirani testovi vezani uz ispitivanje EM kompatibilnosti omogućavaju ocjenu usklađenosti proizvedenih elektroničkih uređaja s normama propisanima standardima. Ukoliko elektronički uređaj ne zadovolji propisane norme, potrebno je ići u doradu i redizajn uređaja što može uvelike povisiti njegovu cijenu. Cilj istraživanja je omogućiti sklopovske simulacije testova EM kompatibilnosti na pojedinim elementima elektroničkog sklopa, tj. prospojima. Razvoj sklopovskih modela EM sprege omogućit će identifikaciju mogućih problema vezanih uz EM radijaciju za vrijeme razvoja uređaja i time smanjiti cijenu proizvodnje te povećati pouzdanost sustava. TEM ćelija i IC-Stripline ćelija predstavljaju standardne metode izvođenja testova EM kompatibilnosti vezanih uz radijaciju i susceptibilnost. Njihovi sklopovski modeli su razvijeni kao i sklopovski model EM sprege. Prospoji koji su obrađeni u ovome radu su pakiranja integriranih sklopova i prijenosne linije. Metoda odzivnih površina temeljena na EM simulacijama korištena je u svrhu razvoja skalabilnih sklopovskih modela pakiranja integriranih sklopova. Također su razvijeni širokopojasni modeli SMA konektora i prijenosnih linija. Točnost razvijenih sklopovskih modela je vrlo dobra što omogućava njihovu primjenu za sklopovske simulacije testova EM kompatibilnosti složenih elektroničkih sustava

Modeliranje pakiranja integriranih sklopova i elektromagnetske sprege s prospojnim linijama

In recent years, due to an increasing level of electromagnetic (EM) pollution, the electronic circuits are confronting rising demands on electromagnetic compatibility (EMC). Since EMC has become one of the major causes of printed circuit board (PCB) and integrated circuit redesign, the prediction of the EM field interference is of great importance. Standardized EMC tests enable the assessment of the compliance of electronic circuits to the imposed norms. Inability of the electronic circuit to comply with the standards may result in significant increase of production cost and time to market. The goal of this research is to enable circuit simulations of EMC pre-compliance tests of critical elements of electronic circuits, i.e. interconnects. The development of circuit models of the EM coupling to interconnects enables identification of possible radiated EMC issues during the circuit design flow and consequently decrease the production cost and increase system reliability. The TEM cell and IC-Stripline present the standard methods for the radiated emission and immunity pre-compliance EMC tests. In this work, the TEM cell and IC-Stripline equivalent circuit models are developed as well as the circuit models of EM field coupling to the printed circuit board traces. The interconnects considered in this work are IC packages and transmission lines. The response surface methodology based on EM simulations is used to build scalable circuit models of IC packages. The broadband modelling of SMA connectors and transmission lines is performed. The accuracy of the developed circuit models is very good and the models present a significant step towards reliable circuit simulations of the complex electronic system pre-compliance EMC tests.Današnji elektronički sklopovi imaju stroge kriterije za elektromagnetsku (EM) kompatibilnost pa je stoga od velikog značaja mogućnost predviđanja sprege EM polja s elementima elektroničkog sklopa. Standardizirani testovi vezani uz ispitivanje EM kompatibilnosti omogućavaju ocjenu usklađenosti proizvedenih elektroničkih uređaja s normama propisanima standardima. Ukoliko elektronički uređaj ne zadovolji propisane norme, potrebno je ići u doradu i redizajn uređaja što može uvelike povisiti njegovu cijenu. Cilj istraživanja je omogućiti sklopovske simulacije testova EM kompatibilnosti na pojedinim elementima elektroničkog sklopa, tj. prospojima. Razvoj sklopovskih modela EM sprege omogućit će identifikaciju mogućih problema vezanih uz EM radijaciju za vrijeme razvoja uređaja i time smanjiti cijenu proizvodnje te povećati pouzdanost sustava. TEM ćelija i IC-Stripline ćelija predstavljaju standardne metode izvođenja testova EM kompatibilnosti vezanih uz radijaciju i susceptibilnost. Njihovi sklopovski modeli su razvijeni kao i sklopovski model EM sprege. Prospoji koji su obrađeni u ovome radu su pakiranja integriranih sklopova i prijenosne linije. Metoda odzivnih površina temeljena na EM simulacijama korištena je u svrhu razvoja skalabilnih sklopovskih modela pakiranja integriranih sklopova. Također su razvijeni širokopojasni modeli SMA konektora i prijenosnih linija. Točnost razvijenih sklopovskih modela je vrlo dobra što omogućava njihovu primjenu za sklopovske simulacije testova EM kompatibilnosti složenih elektroničkih sustava

Analiza metoda za mjerenje fazora u uređajima numeričke relejne zaštite korištenjem Fourierovih filtara

U radu su analizirane metode za mjerenje fazora u uređajima numeričke relejne zaštite korištenjem Fourierovih filtara. Obrađene su značajke Fourierovih filtara s obzirom na duljinu impulsnog odziva. Metode za korekciju utjecaja eksponencijalno padajuće istosmjerne komponente odabrane su s obzirom na domenu korekcije (frekvencijska ili vremenska domena) i složenost njihove implementacije. Metode su analizirane optimizacijom odziva amplitude mjerenog fazora, s obzirom na parametre signala kvara. Definirana su mjerila kvalitete za ocjenu efikasnosti eliminacije utjecaja eksponencijalno padajuće istosmjerne komponente. Svaka od razmatranih metoda primijenjena je na stvarne signale kvarova.This thesis presents analysis of phasor measurement methods in digital protective relays by using Fourier filters. Characteristics of Fourier filters have been investigated with respect to their impulse response length. Methods for suppression of exponentially decaying DC offset have been chosen with respect to type of correction domain (frequency or time domain) and numerical effort. Methods are analyzed by optimization of measured phasor amplitude response with respect to the fault signal parameters. Performance indices are defined in order to estimate suppression efficiency of exponentially decaying DC offset. Each investigated method is applied on real fault signals

Modeliranje pakiranja integriranih sklopova i elektromagnetske sprege s prospojnim linijama

In recent years, due to an increasing level of electromagnetic (EM) pollution, the electronic circuits are confronting rising demands on electromagnetic compatibility (EMC). Since EMC has become one of the major causes of printed circuit board (PCB) and integrated circuit redesign, the prediction of the EM field interference is of great importance. Standardized EMC tests enable the assessment of the compliance of electronic circuits to the imposed norms. Inability of the electronic circuit to comply with the standards may result in significant increase of production cost and time to market. The goal of this research is to enable circuit simulations of EMC pre-compliance tests of critical elements of electronic circuits, i.e. interconnects. The development of circuit models of the EM coupling to interconnects enables identification of possible radiated EMC issues during the circuit design flow and consequently decrease the production cost and increase system reliability. The TEM cell and IC-Stripline present the standard methods for the radiated emission and immunity pre-compliance EMC tests. In this work, the TEM cell and IC-Stripline equivalent circuit models are developed as well as the circuit models of EM field coupling to the printed circuit board traces. The interconnects considered in this work are IC packages and transmission lines. The response surface methodology based on EM simulations is used to build scalable circuit models of IC packages. The broadband modelling of SMA connectors and transmission lines is performed. The accuracy of the developed circuit models is very good and the models present a significant step towards reliable circuit simulations of the complex electronic system pre-compliance EMC tests.Današnji elektronički sklopovi imaju stroge kriterije za elektromagnetsku (EM) kompatibilnost pa je stoga od velikog značaja mogućnost predviđanja sprege EM polja s elementima elektroničkog sklopa. Standardizirani testovi vezani uz ispitivanje EM kompatibilnosti omogućavaju ocjenu usklađenosti proizvedenih elektroničkih uređaja s normama propisanima standardima. Ukoliko elektronički uređaj ne zadovolji propisane norme, potrebno je ići u doradu i redizajn uređaja što može uvelike povisiti njegovu cijenu. Cilj istraživanja je omogućiti sklopovske simulacije testova EM kompatibilnosti na pojedinim elementima elektroničkog sklopa, tj. prospojima. Razvoj sklopovskih modela EM sprege omogućit će identifikaciju mogućih problema vezanih uz EM radijaciju za vrijeme razvoja uređaja i time smanjiti cijenu proizvodnje te povećati pouzdanost sustava. TEM ćelija i IC-Stripline ćelija predstavljaju standardne metode izvođenja testova EM kompatibilnosti vezanih uz radijaciju i susceptibilnost. Njihovi sklopovski modeli su razvijeni kao i sklopovski model EM sprege. Prospoji koji su obrađeni u ovome radu su pakiranja integriranih sklopova i prijenosne linije. Metoda odzivnih površina temeljena na EM simulacijama korištena je u svrhu razvoja skalabilnih sklopovskih modela pakiranja integriranih sklopova. Također su razvijeni širokopojasni modeli SMA konektora i prijenosnih linija. Točnost razvijenih sklopovskih modela je vrlo dobra što omogućava njihovu primjenu za sklopovske simulacije testova EM kompatibilnosti složenih elektroničkih sustava

Analiza metoda za mjerenje fazora u uređajima numeričke relejne zaštite korištenjem Fourierovih filtara

U radu su analizirane metode za mjerenje fazora u uređajima numeričke relejne zaštite korištenjem Fourierovih filtara. Obrađene su značajke Fourierovih filtara s obzirom na duljinu impulsnog odziva. Metode za korekciju utjecaja eksponencijalno padajuće istosmjerne komponente odabrane su s obzirom na domenu korekcije (frekvencijska ili vremenska domena) i složenost njihove implementacije. Metode su analizirane optimizacijom odziva amplitude mjerenog fazora, s obzirom na parametre signala kvara. Definirana su mjerila kvalitete za ocjenu efikasnosti eliminacije utjecaja eksponencijalno padajuće istosmjerne komponente. Svaka od razmatranih metoda primijenjena je na stvarne signale kvarova.This thesis presents analysis of phasor measurement methods in digital protective relays by using Fourier filters. Characteristics of Fourier filters have been investigated with respect to their impulse response length. Methods for suppression of exponentially decaying DC offset have been chosen with respect to type of correction domain (frequency or time domain) and numerical effort. Methods are analyzed by optimization of measured phasor amplitude response with respect to the fault signal parameters. Performance indices are defined in order to estimate suppression efficiency of exponentially decaying DC offset. Each investigated method is applied on real fault signals