25 research outputs found

    POTENSI SERTA PELUANG USAHA KECIL PADA WISATA PESISIR DI KECAMATAN KUTA SELATAN, KABUPATEN BADUNG, BALI

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    Pariwisata di Bali merupakan pariwisata yang banyak menawarkan keindahan alamnya, salah satunya yaitu Wisata pesisir yang ada di Bali. Wisata pesisir memicu adanya pembangunan yang sangat pesat di pesisir tanpa memperhatikan lingkungan sekitar pesisir. Destinasi wisata pesisir yang dikunjungi secara berkelanjutan dan memberikan dampak pada kualitas lingkungan pesisir di daerak Kuta Selatan. Pembangunan wisata di pesisir masih didasarkan pada permintaan wisatawan untuk menikmati keindahan alam pesisir dan belum mempertimbangkan keberlanjutan lingkungan pesisir serta berdampak pada peningkatan usaha – usaha kecil yang ada di sekitaran pesisir guna menunjang kebutuhan wisatawan yang berkunjung. Penelitian ini bertujuan untuk mengetahui peluang keeksistensian usaha kecil pada lingkungan pesisir di Kecamatan Kuta Selatan saat ini dan memberikan solusi berupa perencanaan dan pengelolaan wisata pesisir yang terintegrasi Penelitian ini dilakukan di Kecamatan Kuta Selatan, Kabupaten Badung, Bali. Metode kualitatif digunakan dalam penelitian ini dengan menggunakan berbagai indikator penilaian untuk mengetahui peluang keeksistensian pada usaha-usaha kecil yang ada di pesisir. Teori SWOT dan konsep pariwisata berkelanjutan untuk pengembangan digunakan sebagai dasar dalam penyusunan perencanaan pariwisata pesisir berkelanjutan di Kuta Selatan. Konsep pengelolaan kawasan pesisir terintegrasi digunakan sebagai dasar penyusunan program pengelolaan kawasan wisata pesisir terintegrasi

    PENGARUH DEWAN KOMISARIS INDEPENDEN, KEPEMILIKAN INSTITUSIONAL, PROFITABILITAS DAN LEVERGE TERHADAP TAX AVOIDANCE

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    This study aimed to demonstrate empirically the influence of independent board, institutional ownership, profitability and leverage against tax avoidance in the service sector companies in the Stock Exchange 2012- 2014. The theory used in this research is the theory of the Agency (Agency Theory), Theory of Compliance and Accounting Theory Positive. The population used in this study are all companies listed on the Stock Exchange the period of 2012- 2014 as many as 268 companies. The samples in this study using the purposive sampling method. The data collection is done by dokumentasi. Data analysis used is multiple linear regression analysis. The results this research showed that the independent board have negatively affect the profitability of tax avoidance. Institutional ownership variable and leverage have  positive effect on tax avoidance

    Health diagnosis and recuperation of aged Li-ion batteries with data analytics and equivalent circuit modeling

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    Battery health assessment and recuperation play a crucial role in the utilization of second-life Li-ion batteries. However, due to ambiguous aging mechanisms and lack of correlations between the recovery effects and operational states, it is challenging to accurately estimate battery health and devise a clear strategy for cell rejuvenation. This paper presents aging and reconditioning experiments of 62 commercial high-energy type lithium iron phosphate (LFP) cells, which supplement existing datasets of high-power LFP cells. The relatively large-scale data allow us to use machine learning models to predict cycle life and identify important indicators of recoverable capacity. Considering cell-to-cell inconsistencies, an average test error of 16.84%±1.87%16.84\% \pm 1.87\% (mean absolute percentage error) for cycle life prediction is achieved by gradient boosting regressor given information from the first 80 cycles. In addition, it is found that some of the recoverable lost capacity is attributed to the lateral lithium non-uniformity within the electrodes. An equivalent circuit model is built and experimentally validated to demonstrate how such non-uniformity can be accumulated, and how it can give rise to recoverable capacity loss. SHapley Additive exPlanations (SHAP) analysis also reveals that battery operation history significantly affects the capacity recovery.Comment: 20 pages, 5 figures, 1 tabl

    The integration of InGaP LEDs with CMOS on 200 mm silicon wafers

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    The integration of photonics and electronics on a converged silicon CMOS platform is a long pursuit goal for both academe and industry. We have been developing technologies that can integrate III-V compound semiconductors and CMOS circuits on 200 mm silicon wafers. As an example we present our work on the integration of InGaP light-emitting diodes (LEDs) with CMOS. The InGaP LEDs were epitaxially grown on high-quality GaAs and Ge buffers on 200 mm (100) silicon wafers in a MOCVD reactor. Strain engineering was applied to control the wafer bow that is induced by the mismatch of coefficients of thermal expansion between III-V films and silicon substrate. Wafer bonding was used to transfer the foundry-made silicon CMOS wafers to the InGaP LED wafers. Process trenches were opened on the CMOS layer to expose the underneath III-V device layers for LED processing. We show the issues encountered in the 200 mm processing and the methods we have been developing to overcome the problems

    Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuits

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    Vertically stacking and bonding individual processed wafers with through-Si vias (TSV) to form three dimensional integrated circuits (3DIC) introduces the possibility of reducing signal propagation delay, a reduction in power consumption and heterogeneous device integration. Cu thermocompression bonding is seen as a general route to realize 3DIC, with bonded metals providing both mechanical adhesion as well as electrical interconnection. Mechanical testing to assess the bond quality of bonded processed wafers can be very costly, particularly on production wafers which have multilayer devices designed in the chips. A new non-destructive characterization method based on measured resonance frequency is proposed. Capacitive and resistive characteristics of the contact interface are amplified and utilized with a designed external circuit that consists of an inductor and a resistor. This new measurement technique shows an improvement in sensitivity as compared to contact resistance measurement, as well as eliminates stray resistance effect from line resistance and probing contact resistance. A 3D bonded Cu-Cu test structure that enables three methods of bond interface characterization, i.e. electrical contact resistance measurement, resonance-frequency characterization method and die shear test was designed and fabricated.DOCTOR OF PHILOSOPHY (MSE

    Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interface

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    Metal to metal bonding, particularly Cu-Cu bonding, is an important part of three dimensional integrated circuits (3DICs) that utilizes wafer bonding. The use of Cu to Cu bonding in 3DICs is advantageous as it functions as both the glue layer and electrical interconnection. It has been observed that the contact resistance of bonded Cu interface could be decreased under direct current stressing. In this paper the mentioned phenomena is modeled and simulated. Electromigration induced contact resistance reduction of bonded interconnects may provide a method for post-bonding bond property improvement for 3DICsPublished versio

    Analysis of the Potential of the Bumbung Gebyog Dance as an Effort to Develop Cultural Tourism Attractions in the Pinge Tourism Village

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    The development of tourism activities at this time is going well. This can be seen from the development of various tourist attractions starting from the development of tourist villages and special interest attractions to accommodate the needs of tourists. One of the tourist activities that is quite interesting for tourists at this time is cultural tourism. Cultural tourism is said to be able to attract tourists' interest in visiting because when implemented, this tourist activity can invite tourists to learn more about the conditions of community activities, artistic activities and many other things.  This research the aim will be to analyze the potential of the Bumbung Gebyog dance and gamelan as a cultural tourism attraction in Pinge Village. The method used in this research is descriptive analysis and observational studies which are more oriented towards the use of qualitative methods in it. Descriptive analysis is used to describe the potential of the Bumbung Gebyog Dance and Gamelan as cultural potential by reading several related research literature and observational studies will be used to ensure the validity of the data that has been obtained through the literature. The results of this research found that Pinge Tourism Village can optimize the potential of the Gebyog Bumbung Dance as the main attraction in developing cultural tourism performances, while ensuring the preservation and preservation of this valuable cultural heritage

    EVALUASI PENGENDALIAN SISTEM INFORMASI PEMBELIAN DAN PERSEDIAAN BARANG PADA APOTEK K-24 CABANG CIPONDOH

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    EVALUASI PENGENDALIAN SISTEM INFORMASI PEMBELIAN DAN PERSEDIAAN BARANG PADA APOTEK K-24 CABANG CIPONDOH

    Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits

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    While the ultimate goal of Cu interconnection in 3D-IC is to have Cu as both the glue layer and interconnection line, there has been numerous demonstration of Cu-Cu bonding that shows the bonding interface is not always perfect. This work investigates the evolution of Cu-Cu bond interface under prolonged current stress by combining electrical current stressing and bond interface cross-sectional analysis. Voids at the bond interface were observed to be driven by electromigration to the adjoining interconnect line, leading to early failures of the line. This may have significant impact on the future of 3D-IC technology that utilizes Cu-Cu bonding, and it may be mitigated by inserting a barrier layer in between the bond interface and the interconnect line

    Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation

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    We have systematically studied the effects of SixN1 − x passivation density on the reliability of AlGaN/GaN high electron mobility transistors. Upon stressing, devices degrade in two stages, fast-mode degradation and followed by slow-mode degradation. Both degradations can be explained as different stages of pit formation at the gate-edge. Fast-mode degradation is caused by pre-existing oxygen at the SixN1 − x/AlGaN interface. It is not significantly affected by the SixN1 − x density. On the other hand, slow-mode degradation is associated with SixN1 − x degradation. SixN1 − x degrades through electric-field induced oxidation in discrete locations along the gate-edges. The size of these degraded locations ranged from 100 to 300 nm from the gate edge. There are about 16 degraded locations per 100 μm gate-width. In each degraded location, low density nano-globes are formed within the SixN1 − x. Because of the low density of the degraded locations, oxygen can diffuse through these areas and oxidize the AlGaN/GaN to form pits. This slow-mode degradation can be minimized by using high density (ρ = 2.48 g/cm3) Si36N64 as the passivation layer. For slow-mode degradation, the median time to failure of devices with high density passivation is found to increase up to 2× as compared to the low density (ρ = 2.25 g/cm3) Si43N57 passivation. A model based on Johnson-Mehl-Avrami theory is proposed to explain the kinetics of pit formation.NRF (Natl Research Foundation, S’pore)ASTAR (Agency for Sci., Tech. and Research, S’pore)Accepted versio
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