3 research outputs found

    Additive manufactured antenna in mixed material technology for 24 GHz FMCW miniaturized radar

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    \u3cp\u3eA 24 GHz antenna design for miniaturized FMCW radar is presented. The antenna was manufactured with additive manufacturing technology at TNO. The characterization of the polymer material used in the fabrication was carried out and the measurement results of the antenna are presented in this work. A good agreement between simulations and measurements was achieved.\u3c/p\u3

    Additive manufactured antenna in mixed material technology for 24 GHz FMCW miniaturized radar

    No full text
    \u3cp\u3eA 24 GHz antenna design for miniaturized FMCW radar is presented. The antenna was manufactured with additive manufacturing technology at TNO. The characterization of the polymer material used in the fabrication was carried out and the measurement results of the antenna are presented in this work. A good agreement between simulations and measurements was achieved.\u3c/p\u3

    3D Printed structural electronics:embedding and connecting electronic components into freeform electronic devices

    No full text
    \u3cp\u3eThe need for personalised and smart products drives the development of structural electronics with mass-customisation capability. A number of challenges need to be overcome in order to address the potential of complete free form manufacturing of electronic devices. One key challenge is the integration of conductive structures and components into 3D printed devices by combining different materials and printing techniques that have nearly incompatible printing conditions. In this paper, several methods to integrate electronic circuits and components into a 3D printed structure are discussed. The functional performance of the resulting structures is described. Structural parts were manufactured with a stereolithography-based 3D printing technique, which was interrupted to pick and place electronic components, followed by either direct writing or squeegee filling of conductive material. A thermal curing step was applied to enhance the bonding and improve the electrical performance. Optical micrography, 4-point resistance measurement and cross-sectional analysis were performed to evaluate functionality.\u3c/p\u3
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