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3 research outputs found
Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
Author
A Briggs
F Naumann
+11 more
G Wallis
K. Schjølberg-Henriksen
MMV Taklo
QY Tong
R Knechtel
R Knechtel
S Brand
S Brand
S. Brand
S. T. Moe
S. Tismer
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Solid-State Microjoining Processes in Manufacturing
Author
A Mertol
A Zompi
+44 more
ASM Handbook
B Krabbenborg
BD Cullity
C Fan
CD Breach
CH Tsau
CH Tsau
CH Tsau
CS Tan
CT Ko
DM Tench
E Loh
G Camenschi
G Qi
GG Harman
H Oppermann
H Xu
IJ Huang
J Li
J Li
J Onuki
L Maiocco
LC Chin
MG Fontana
MMV Taklo
NF Kazakov
PI Wang
RW Johnson
S Murali
S Murali
S Murali
S Murali
S Murali
S Murali
SK Prasad
TH Kim
XF Ang
XF Ang
XF Ang
XF Ang
XF Ang
YG Kim
YW Lin
ZW Zhong
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Solid State Microjoining Processes in Manufacturing
Author
A Mertol
A Zompi
+46 more
ASM Handbook
B Derby
B Krabbenborg
BD Cullity
C Fan
CD Breach
CH Tsau
CH Tsau
CH Tsau
CS Tan
CT Ko
DM Tench
E Loh
G Camenschi
G Qi
GG Harman
H Oppermann
H Xu
IJ Huang
J Li
J Li
J Onuki
L Maiocco
LC Chin
MG Fontana
MMV Taklo
NF Kazakov
PI Wang
RW Johnson
S Murali
S Murali
S Murali
S Murali
S Murali
S Murali
SK Prasad
TH Kim
XF Ang
XF Ang
XF Ang
XF Ang
XF Ang
YG Kim
YH Chew
YW Lin
ZW Zhong
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref