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1 research outputs found
Microstructure evolution and tensile creep behavior of Sn–0.7Cu lead-free solder reinforced with ZnO nanoparticles
Author
A Fawzy
A. F. Abd El-Rehim
+28Â more
A. M. Yassin
AA El-Daly
AF Abd El-Rehim
AF Abd El-Rehim
AF Abd El-Rehim
AF Abd El-Rehim
AF Abd El-Rehim
AK Gain
AN Fouda
CML Wu
CML Wu
GS Al-Ganainy
H. Y. Zahran
HG Song
HY Zahran
J Shen
J Shen
LC Tsao
LF Li
MH Mahdavifard
MII Ramli
ML Huang
R Mahmudi
RM Shalaby
SN Alam
XL Zhong
Z Fathian
Z Lai
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
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