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4 research outputs found

Effect of aluminum addition on the electrochemical corrosion behavior of Sn–3Ag–0.5Cu solder alloy in 3.5 wt% NaCl solution

Author: A Wierzbicka-Miernik
A. S. M. A. Haseeb
AK Gain
CMA Brett
D Li
E Rosalbino
F Rosalbino
K Kim
L Díaz-Ballote
L Hua
L Zhang
L Zhang
M Asaduzzaman
M Huang
M Huang
M Wang
M. A. Fazal
M. Fayeka
MFM Nazeri
MFM Nazeri
N Bai
P Okafor
S Yuan
SK Das
US Mohanty
US Mohanty
US Mohanty
US Mohanty
US Mohanty
US Mohanty
W Badawy
W Luo
X Li
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Corrosion behavior of Sn-based lead-free solder alloys: a review

Author: A Sharma
AA El-Daly
AK Gain
AK Gain
B Liao
B Liu
BX Vuong
CW See
D Chan
D Li
ES Freitas
F Mohd Nazeri Muhammad
F Ochoa
F Rosalbino
F Rosalbino
F Rosalbino
H Huang
H Ma
H Wang
H Wang
HA Jaffery
HZ Huang
J Hu
J Li
J Shen
J Wu
JC Liu
JC Liu
JC Liu
JC Liu
JC Liu
JC Liu
JP Tucker
K Yokoyama
KL Lin
KL Lin
L Hua
L Zhang
LM Satizabal
LM Satizabal
LR Garcia
LY Xu
M Fayeka
M Grobelny
M Hasnine
M Liu
M Mostofizadeh
M Wang
M Wang
M Wang
M Wang
M Wang
MA Ameer
MA Ameer
MA Fazal
MF Mohd Nazeri
MFM Nazeri
MFM Nazeri
MFM Nazeri
ML Huang
MN Wang
MY Xiong
N Jiang
NIM Nordin
NK Liyana
NWB Subri
P Tunthawiroon
Q Li
QV Bui
RB Comizzoli
RK Kaushik
S Farina
S Li
S Liu
S Tian
S Zhang
S Zhang
TC Chang
TC Chang
TK Lee
TK Yeh
US Mohanty
US Mohanty
W Jie
W Yang
WK Lee
WR Osório
WR Osório
WR Osório
X Li
X Liu
X Zhong
X Zhong
XK Zhong
XK Zhong
YD Han
YF Gao
Z Hou
Z Wang
Z Wang
Z Wang
Z Wang
Z Yan
Z Yan
Z Yan
Z Zhang
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Mixing enthalpy of Ag–Sn system at 1150 °C

Author: Andrey Bykov
AT Dinsdale
C Luef
CY Ho
D Giuranno
DA Shnawah
E Öztürk
Eduard Pastukhov
F Khodabakhshi
F Tian
F Wang
H Flandorfer
HR Kotadia
J Keller
KI Oleinik
Ksenia Oleinik
M Drienovsky
M Mouas
MFM Nazeri
MJ Pool
ML Huang
NAAM Amin
O Kubaschewski
RL Sharkey
RR Hultgren
S Cheng
S Herat
S Xu
UD Veryatin
VV Filippov
X Hu
Y Yang
Z Li
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging

Author: A Kumar
A Kumar
A Kumar
A Li
CE Ho
CF Tseng
CH Wang
CK Chung
CY Ho
DG Kim
HF Zou
J Shen
JC Liu
JW Jang
JW Jang
JW Yoon
JW Yoon
JW Yoon
JW Yoon
K Zeng
L Magagnin
L Zhang
MFM Nazeri
Min Lei
MM Younan
MO Alam
MO Alam
MY Tsai
PJ Shang
PL Liu
PL Liu
RL Melo
S Amore
SW Kim
TL Yang
TS Narayanan
X Hu
X Hu
Xiaowu Hu
Xuewen Li
Y Liu
Y Yang
YJ Hu
Yulong Li
YW Wang
Z Bangwei
Zhiliang Wang
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

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