Understanding the Frequency Dependence of Capacitance Measurements of Irradiated Silicon Detectors

Capacitance-voltage (CV) measurements are a widely used technique in silicon detector physics. It gives direct information about the full depletion voltage and the effective doping concentration. However, for highly irradiated sensors, the measured data differs significantly from the usual shape which makes the extraction of the afore mentioned parameters less precise to not possible. We present an explanation for the obseved frequency dependence and based on that, a method to extract the desired sensor parameters

A Unified Parameterization of the Formation of Boron Oxygen Defects and their Electrical Activity

AbstractThe magnitude of light-induced degradation of solar cells based on Czochralski grown silicon strongly depends on material properties. We have performed experiments to describe the activation and recombination activity of boron oxygen defects in boron compensated n-type silicon. Compensated n-type material enables flexible assessment of charge carrier influences on the defect that cannot be distinguished on p-type material. The results can be generalized to p-type material and thus provide valuable insights to the defect. Our measurements demonstrate the two-level defect nature of the slow-formed boron oxygen defect component and allow the study of the dopant dependency of the defect concentrations. Our findings strongly support a revision of the existing model of the defect composition.Based on the experimental results and literature data we have created a parameterization of the lifetime limitation in silicon due to BO defects. Established findings from literature for uncompensated p-type silicon are taken into account and ensure general validity. The parameterization is useful to discuss BO defect influences and can serve to predict material properties after LID

Characterization of Passive CMOS Strip Sensors

Recent advances in CMOS imaging sensor technology , e.g. in CMOS pixel sensors, have proven that the CMOS process is radiation tolerant enough to cope with certain radiation levels required for tracking layers in hadron collider experiments. With the ever-increasing area covered by silicon tracking detectors cost effective alternatives to the current silicon sensors and more integrated designs are desirable. This article describes results obtained from laboratory measurements of silicon strip sensors produced in a passive p-CMOS process. Electrical characterization and charge collection measurements with a 90Sr source and a laser with infrared wavelength showed no effect of the stitching process on the performance of the sensor.Comment: 6 pages, 16 figure

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.Comment: 82 pages, 66 figure

Evaluation of passive CMOS strip sensors

Silicon sensors will continue to be the central tracking elements for upcoming particle physics detectors. They will have to cover large areas and thus be a main cost driver. The silicon sensors currently used are available only from very few manufacturers, thus detector technologies and designs that can be realized through established commercial industrial production processes and are cost-effective are becoming increasingly relevant. The CMOS technology is one of the important candidates. Since typically CMOS foundries are equipped for producing much smaller sizes than the currently used wafer-scale strip sensors, several neighbouring reticles have to be connected via a stitching process to obtain large sensors. In this study, strip sensors were designed and developed with the passive p-CMOS 150 nm process including stitching of up to five reticles. After initial electrical characterizations the sensors were tested in the laboratory with a 90Sr source and infrared lasers. The key investigation was to evaluate the impact of stitching on the sensor performance. The results presented will demonstrate that the stitching does not show any negative effect on the sensor performance before and after irradiation, and the stitching process is successful

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2,2] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests