Ultrathin organic films for corrosion protection in microelectronic devices

In view of ever decreasing dimensions in microelectronic devices the question of how to effectively protect the multilevel interconnections from corrosion induced malfunctions becomes more and more important. The possible role of ultrathin organic films lies both in corrosion protection itself and in adhesion promotion of an additional polymeric layer for encapsulation. This paper will focus on the modification of two metals widely used in microelectronic compounds: copper and aluminium