7 research outputs found
A new accurate closed-form analytical solution for junction temperature of high-powered devices
10.1115/1.4026352Journal of Electronic Packaging, Transactions of the ASME1361-JEPA
Accurate thermal characterization of a GaN PA MMIC using Thermoreflectance thermography
10.1109/ICEPT.2013.6756595Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013843-84
Thermal analysis of high-powered devices using analytical and experimental methods
10.1109/ICEPT-HDP.2012.6474902ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging1550-155
Thermal characterization and modelling of a gallium arsenide power amplifier MMIC
10.1109/ITHERM.2012.6231464InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM440-44
Measurement of MMIC gate temperature using infrared and Thermoreflectance thermography
10.1109/EPTC.2012.6507136Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012515-51
Novel development of the micro-tensile test at elevated temperature using a test structure with integrated micro-heater
10.1088/0960-1317/22/8/085015Journal of Micromechanics and Microengineering228-JMMI
Loss of maternal Trim28 causes male-predominant early embryonic lethality
10.1101/gad.291195.116Genes and Development311Dec-1