7 research outputs found

    A new accurate closed-form analytical solution for junction temperature of high-powered devices

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    10.1115/1.4026352Journal of Electronic Packaging, Transactions of the ASME1361-JEPA

    Accurate thermal characterization of a GaN PA MMIC using Thermoreflectance thermography

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    10.1109/ICEPT.2013.6756595Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013843-84

    Thermal analysis of high-powered devices using analytical and experimental methods

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    10.1109/ICEPT-HDP.2012.6474902ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging1550-155

    Thermal characterization and modelling of a gallium arsenide power amplifier MMIC

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    10.1109/ITHERM.2012.6231464InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM440-44

    Measurement of MMIC gate temperature using infrared and Thermoreflectance thermography

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    10.1109/EPTC.2012.6507136Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012515-51
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