Double Patterning Technique Using an Aluminum Hardmask

The goal of this project was to successfully demonstrate a double patterning technique using equipment available at the SMFL at RIT. Traditional methods of increasing resolution have been essentially exhausted; therefore new methods of increasing resolution are needed. One of these new methods is double patterning, which splits a dense pattern into two less dense patterns which are imaged in two steps, thereby reducing imaging constraints. Overall a proof of concept of the double patterning process was achieved. Imaging of 0.5 μm drawn features was demonstrated, resulting in 0.3 μm post-etch

The Journal of Microelectronic Research 2008

https://scholarworks.rit.edu/meec_archive/1016/thumbnail.jp