Deterministic Dense Coding and Faithful Teleportation with Multipartite Graph States

We proposed novel schemes to perform the deterministic dense coding and faithful teleportation with multipartite graph states. We also find the sufficient and necessary condition of a viable graph state for the proposed scheme. That is, for the associated graph, the reduced adjacency matrix of the Tanner-type subgraph between senders and receivers should be invertible.Comment: 10 pages, 1 figure;v2. discussions improve

A Machine Learning Approach for Desktop and Application Virtualization Design in Cloud Environment

In recent years, virtual desktop and virtual application is the important research topic for virtualization of cloud computing. Virtualization provides many benefits by using virtual machine software, including we can efficiently deploy and manage all of virtual system resources, and it offers the ability of high reliability, high elasticity and customization. In order to share the system and software resources, related basic knowledge show in our paper about the virtualization technology of desktop and application, and we proposed the virtual desktop and application services to offer an efficient and elastic service for cloud platform. A machine learning approach is also applied to manage resource allocation. It implements the VDaaS (Virtual Desktop as a Service) and VAaaS (Virtual Application as a Service) by developing the sharing technology for virtual desktop and virtual application with the cloud platform

The reliability of amorphous-InGaZnO4 thin film transistor influence by self-heating stress at high temperature under compressive strain

Flexible thin-film transistors (TFTs) play an important role in flexible technology applications, including wearable devices and high-resolution foldable displays and as curved displays. A reliability test was performed in this work, including mechanism and electrical stress at high temperature. An abnormal hump can be found in flexible a-InGaZnO4 TFTs after a self-heating stress at 90°C under compressive bending. COMSOL simulation confirmed that the etching stop layer absorbs more mechanism stress than the gate insulator. Accordingly, during the reliability stress, holes induced by the impact ionization tend to inject into the defect in the etching stop layer near the source side rather than the gate insulator, which is induced by compressive bending. Single side C-V measurement and forward/reverse-operation mode are utilized to analyze the hole trapping distribution. Please click Additional Files below to see the full abstract