Exact solution for stresses/displacements in a multilayered hollow cylinder under thermo-mechanical loading

In this study, a new analytical solution by the recursive method for evaluating stresses/displacements in multilayered hollow cylinder under thermo-mechanical loading was developed. The results for temperature distribution, displacements and stresses obtained by using the proposed solution were shown to be in good agreement with the FEM results. The proposed analytical solution was also found to produce more accurate results than those by the analytical solution reported in literature

Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints

This work utilizes the lap shear test to investigate the shear strength and fracture behaviour of electroplated and reflowed Sn–Bi/Cu lead-free solder joints. Particular emphasis is given on the effects of reflow temperature on the interrelationships among the interfacial intermetallic compound (IMC) morphology, shear strength and the fracture mechanism of the solder joints. Single-lap shear specimens are prepared by joining two commercially pure Cu substrates with electroplated Sn–Bi solder of about 50 µm thickness. The geometry of the lap shear specimen is designed to minimize the differences between far-field and actual responses of the solder. Three reflow temperatures (200, 230 and 260 °C) are used to investigate the effects of reflow temperature on the microstructure and shear strength of the solder. The specimens are loaded to failure at a strain rate of 4 × 10−4/s. Elemental mapping of the fracture surface is performed with field emission scanning electron microscope coupled with energy dispersive X-ray spectroscopy. A reflow temperature of 200 °C yields prism-like interfacial IMC morphology, while higher reflow temperatures of 230 and 260 °C yield scallop-like interfacial IMC morphology. The shear strength and elastic energy release, U, of the solder joints increase with increasing reflow temperature. Fractographs of the failed joints suggest that the fracture mechanism is dependent on the interfacial IMC morphology, where solder joints with prism-like interfacial IMC fail within the bulk solder and solder joints with scallop-like interfacial IMC failed with a mixture of bulk and interfacial fracture

Effects of DC bias on the thermal stability of DC in-line sputtered CoCrTa/Cr thin film media

Materials Research Society Symposium - Proceedings517273-278MRSP

Predicting gains in dementia caregiving

Dementia and Geriatric Cognitive Disorders292115-12

Growth and characterization of dual-beam pulsed-laser-deposited Zn 1-x Co xO thin films

10.1063/1.2060938Journal of Applied Physics9811-JAPI

Assessment of nasal cycle by acoustic rhinometry and rhinomanometry

10.1016/S0194-5998(03)00123-2Otolaryngology - Head and Neck Surgery1284510-516OTOL

Doping of Al-catalyzed vapor-liquid-solid grown Si nanowires

Materials Research Society Symposium Proceedings101866-71MRSP

Structure and Dynamics of the Telomeric Nucleosome and Chromatin

Biological and Soft Matter Physic

Via resistance reduction using "cool" PVD-Ta processing

10.1149/1.1621417Journal of the Electrochemical Society15012G766-G770JESO