(E)-4-Chloro­benzyl 3-(3-nitro­benzyl­idene)dithio­carbazate

In the title compound, C15H12ClN3O2S2, the dihedral angle between the aromatic rings is 89.71 (10)°. In the crystal, inversion dimers linked by pairs of N—H⋯S hydrogen bonds occur

3-(4-Acetoxy­phen­yl)-4-oxo-4H-1-benzopyran-5,7-diyl diacetate

In the title mol­ecule, C21H16O8, the dihedral angle between the ring systems is 58.5 (1)°. In the crystal, C—H⋯O inter­actions help to establish the packing

Investigation of electrical contact resistance for nonconductive film functionalized with Π -conjugated self-assembled molecules

©2007 American Institute of Physics. The electronic version of this article is the complete one and can be found online at: http://link.aip.org/link/?APPLAB/90/092102/1DOI:10.1063/1.2709638Nonconductive adhesive/nonconductive film (NCA/NCF) bonding technology has attracted increasing research interests as lead-free interconnect. During bonding, heat and pressure are applied and the direct physical contacts between the two surfaces of integrated circuit bump and substrate bond pad can be achieved. The electrical contact resistance of a NCA/NCF joint is controlled by the pressure, roughness and NCA/NCF material properties. An accurate prediction of contact resistance can help guide experiment setup towards improving the electrical performance of NCA/NCF. In this study, a model is developed and correlated to experiments. The effects of NCA/NCF material properties on electrical contact resistance are investigated