22 research outputs found
The Belle II SVD detector
The Silicon Vertex Detector (SVD) is one of the main detectors in the Belle II experiment at KEK, Japan. In combination with a pixel detector, the SVD determines precise decay vertex and low-momentum track reconstruction. The SVD ladders are being developed at several institutes. For the development of the tracking algorithm as well as the performance estimation of the ladders, beam tests for the ladders were performed. We report an overview of the SVD development, its performance measured in the beam test, and the prospect of its assembly and commissioning until installation
Belle-II VXD radiation monitoring and beam abort with sCVD diamond sensors
The Belle-II VerteX Detector (VXD) has been designed to improve the performances with respect to Belle and to cope with an unprecedented luminosity of View the MathML source8
71035cm 122s 121 achievable by the SuperKEKB. Special care is needed to monitor both the radiation dose accumulated throughout the life of the experiment and the instantaneous radiation rate, in order to be able to promptly react to sudden spikes for the purpose of protecting the detectors. A radiation monitoring and beam abort system based on single-crystal diamond sensors is now under an active development for the VXD. The sensors will be placed in several key positions in the vicinity of the interaction region. The severe space limitations require a challenging remote readout of the sensors
Belle II silicon vertex detector (SVD)
The Belle II experiment at the SuperKEKB collider in Japan will operate at an unprecedented luminosity of 8
71035 cm 122s 121, about 40 times larger than its predecessor, Belle. Its vertex detector is composed of a two-layer DEPFET pixel detector (PXD) and a four layer double-sided silicon microstrip detector (SVD). To achieve a precise decay-vertex position determination and excellent low-momentum tracking under a harsh background condition and high trigger rate of 10 kHz, the SVD employs several innovative techniques. In order to minimize the parasitic capacitance in the signal path, 1748 APV25 ASIC chips, which read out signal from 224 k strip channels, are directly mounted on the modules with the novel Origami concept. The analog signal from APV25 are digitized by a flash ADC system, and sent to the central DAQ as well as to online tracking system based on SVD hits to provide region of interests to the PXD for reducing the latter\u2019s data size to achieve the required bandwidth and data storage space. Furthermore, the state-of-the-art dual phase CO2 cooling solution has been chosen for a combined thermal management of the PXD and SVD system. In this proceedings, we present key design principles, module construction and integration status of the Belle II SVD
The Belle II silicon vertex detector assembly and mechanics
The Belle II experiment at the asymmetric SuperKEKB collider in Japan will operate at an instantaneous luminosity approximately 50 times greater than its predecessor (Belle). The central feature of the experiment is a vertex detector comprising two layers of pixelated silicon detectors (PXD) and four layers of double-sided silicon microstrip detectors (SVD). One of the key measurements for Belle II is CP violation asymmetry in the decays of beauty and charm hadrons, which hinges on a precise charged-track vertex determination and low-momentum track measurement. Towards this goal, a proper assembly of the SVD components with precise alignment ought to be performed and the geometrical tolerances should be checked to fall within the design limits. We present an overview of the assembly procedure that is being followed, which includes the precision gluing of the SVD module components, wire-bonding of the various electrical components, and precision 3D coordinate measurements of the final SVD modules.Finally, some results from the latest test-beam are reported
The Belle II SVD data readout system
The Belle II Experiment at the High Energy Accelerator Research Organization (KEK) in Tsukuba, Japan, will explore the asymmetry between matter and antimatter and search for new physics beyond the standard model.172 double-sided silicon strip detectors are arranged cylindrically in four layers around the collision point to be part of a system which measures the tracks of the collision products of electrons and positrons. A total of 1748 radiation-hard APV25 chips read out 128 silicon strips each and send the analog signals by time-division multiplexing out of the radiation zone to 48 Flash Analog Digital Converter Modules (FADC).Each of them applies processing to the data; for example, it uses a digital finite impulse response filter to compensate line signal distortions, and it extracts the peak timing and amplitude from a set of several data points for each hit, using a neural network.We present an overview of the SVD data readout system, along with front-end electronics, cabling, power supplies and data processing
Belle II silicon vertex detector
The Belle II experiment at the SuperKEKB collider in Japan is designed to indirectly probe new physics using approximately 50 times the data recorded by its predecessor. An accurate determination of the decay-point position of subatomic particles such as beauty and charm hadrons as well as a precise measurement of low-momentum charged particles will play a key role in this pursuit. These will be accomplished by an inner tracking device comprising two layers of pixelated silicon detector and four layers of silicon vertex detector based on double-sided microstrip sensors. We describe herein the design, prototyping and construction efforts of the Belle-II silicon vertex detector
The monitoring system of the Belle II Vertex Detector
The Belle II VerteX Detector (VXD) is a 6 layers silicon tracker device that will cope with an unprecedented luminosity of 8×1035 cm-2s-1 achievable by the new SuperKEKB e+e- collider, at the KEK laboratory (Tsukuba, Japan). All environment parameters such as temperature, humidity and radiation levels, must be constantly monitored and under certain conditions action must be promptly taken, such as interlocking the power supply or delivering an abort signal to the SuperKEKB collider. In this contribution we describe the Belle II VXD monitoring system. We also present the first results of the temperature and humidity system commissioned in a Beam Test at DESY in April 2016 and the preliminary results of the radiation monitoring achieved with a prototype system during the first SuperKEKB commissioning phase at KEK in February-June 2016
A bonding study toward the quality assurance of Belle-II silicon vertex detector modules
A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor "Origami" method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force
Belle II silicon vertex detector
The Belle II experiment at the SuperKEKB asymmetric energy e+e 12 collider in KEK, Japan will operate at an instantaneous luminosity 40 times larger than that of its predecessor, Belle. It is built with an aim of collecting a huge amount of data (50 ab 121 by 2025) for precise CP violation measurements and new physics search. Thus, we need an accurate vertex determination and reconstruction of low momentum tracks which will be achieved with the help of vertex detector (VXD). The Belle II VXD consists of two layers of DEPFET pixels (`Pixel Detector') and four layers of double-sided silicon microstrip sensors (`Silicon Vertex Detector'), assembled over carbon fibre ribs. In this paper, we discuss about the Belle II Silicon Vertex Detector, especially its design and key features; we also present its module (`ladder') assembly and testing procedures
Belle II SVD ladder assembly procedure and electrical qualification
The Belle II experiment at the SuperKEKB asymmetric collider in Japan will operate at a luminosity approximately 50 times larger than its predecessor (Belle). At its heart lies a six-layer vertex detector comprising two layers of pixelated silicon detectors (PXD) and four layers of double-sided silicon microstrip detectors (SVD). One of the key measurements for Belle II is time-dependent CP violation asymmetry, which hinges on a precise charged-track vertex determination. Towards this goal, a proper assembly of the SVD components with precise alignment ought to be performed and the geometrical tolerances should be checked to fall within the design limits. We present an overview of the assembly procedure that is being followed, which includes the precision gluing of the SVD module components, wire-bonding of the various electrical components, and precision three dimensional coordinate measurements of the jigs used in assembly as well as of the final SVD modules