3D structure design of magnetic ferrite cores using gelcasting and pressure-less sintering process

Gelcasting is a well established process for ceramics manufacturing which recently has been proved to be successful for soft ferrites as well. This approach is particularly interesting for power electronics application in which the magnetic components (e.g. transformers and inductors) are three dimensionally integrated on the power module substrate. This paper proposes a gelcasting process adapted to make it more effective for 3D heterogeneous integration. The main novelties in this direction consist of low solid load (65wt%) and gelation without catalyst to improve casting and de-airing steps. The magnetic properties of gelcast samples are compared with commercial materials and correlated with the microstructure

Copper-based graphene nanoplatelet composites as interconnect for power electronics pacakging

© 2018 IEEE. The present investigation demonstrates a singlestep electrodeposition route for the fabrication of compact copper-based graphene nanoplatelets (GnPs) nanocomposite coatings, with dispersed GnP co-deposition. The effect of cathodic current density on the surface morphology of the deposits was examined. With increasing deposition current densities from 10 to 40 mA/cm 2 , there seemed to be a gradual increase in the lateral size of co-deposited GnPs and a decrease in their distribution density, along with a progressive decrease in the deposit surface feature. The chemical state of GnP from the sub-surface region of composite coatings was assessed using XPS in conjunction with Ar ion sputtering and found comparable to that of pristine GnPs. The Cu-GnP composite coatings exhibited slightly higher electrical sheet resistance, compared to that of the untreated Cu and pure Cu deposited counterparts