Multifunctional Flexible PVDF-TrFE/BaTiO3 Based Tactile Sensor for Touch and Temperature Monitoring

This paper presents an enhanced piezoelectricity based sensor for touch and temperature sensing. The sensor is realized over flexible polyimide film, making it suitable for application like e-skin. The sensing material is composed of Polyvinylidene Fluoride-Trifluoroethylene (PVDF-TrFE) and Barium Titanate (BaTiO3) nanoparticles. While, the piezoelectric polymer PVDF-TrFE ensures the flexibility of sensor, BaTiO3 imparts high sensitivity to touch and temperature. The sensor is tested over temperature range which is common in daily life and the sensitivity to touch is characterized by tapping mode using fixed load. The results confirms the advantage of using poly-ceramic composite over piezoelectric polymer

Temperature compensated tactile sensing using MOSFET with P(VDF-TrFE)/BaTiO3 capacitor as extended gate

This work presents Poly(vinylidene fluoride – trifluoroethylene))/Barium Titanate (P(VDF-TrFE)-BT) nanocomposite based touch sensors tightly coupled with MOSFET devices in extended gate configuration. The P(VDF-TrFE)-BT nanocomposite exploits the distinct piezo and pyroelectric properties of P(VDF-TrFE) polymer matrix and BT fillers to suppress the temperature response when force and temperature are varied simultaneously. The reasons for this unique feature have been established through structural and electrical characterization of nanocomposite. The proposed touch sensor was tested over a wide range of force/pressure (0-4N)/(0-364 Pa) and temperature (26-70°C) with almost linear response. The sensitivity towards force/pressure and temperature sensor are 670 mV/N/7.36 mV/Pa and 15.34 mV/°C respectively. With this modified touch sensing capability, the proposed sensors will open new direction for tactile sensing in robotic applications

Hybrid Structure of Stretchable Interconnect for Reliable E-skin Application

This paper presents the methodology for realisation of stretchable interconnects based on hybrid thin film stack of spray-coated conductive polymer PEDOT: PSS and evaporated gold (Au) film. The PEDOT: PSS film, with its properties in electrical conductivity and mechanical softness, serves as a stress release buffer in the layered hybrid structure. With the serpentine-shape design, the stretchable interconnects can accommodate larger deformation in comparison with a straight line. The correlation between interconnects' morphology (i.e. cracks propagation) with their electrical behaviour has been studied through microscope in along with electrical characterisation under external strain. Furthermore, a comparison in failure strain among different serpentine-shaped designs has been studied. Higher level in stretchability of interconnects can be achieved with a larger arc degree in design. The fabricated stretchable interconnects can accommodate significant deformations up to 72% external strain while maintaining electrically conductive

Metal-organic dual layer structure for stretchable interconnects

This paper reports a novel method for obtaining stretchable interconnects using gold and organic material (PEDOT:PSS) in a dual-layer structure on PDMS substrate. With an appropriate design and carefully carried out microfabrication steps, the structure was successfully patterned into serpentine shape and highly stretchable interconnects were obtained. The fabricated interconnects can be stretched up to 170% of their original length while retaining an adequate level of conductivity

Printable stretchable interconnects

This article presents recent progress and a comprehensive overview of stretchable interconnects based on printable nanocomposites. Nanocomposite-based inks for printed stretchable interconnects have been categorized according to dispersed filler materials. They comprise of carbon-based fillers and metal-based fillers. Benefits in terms of excellent electrical performance and elastic properties make nanocomposites the ideal candidates for stretchable interconnect applications. Deeper analysis of nanocomposites-based stretchable interconnects includes the correlation between the size of fillers, percolation ratio, maximum electrical conductivity and mechanical elasticity. The key trends in the field have been highlighted using curve fitting methods on large data collected from the literature. Furthermore, a wide variety of applications for stretchable interconnects are presented

POSFET tactile sensing arrays using CMOS technology

This work presents fabrication and evaluation of novel POSFET (Piezoelectric Oxide Semiconductor Field Effect Transistor) devices based tactile sensing chip. In the newer version presented here, the tactile sensing chip has been fabricated using CMOS (Complementary Metal Oxide Semiconductor) technology. The chip consists of 4 x 4 POSFET touch sensing devices (or taxels) and both, the individual taxels and the array are designed to match spatio–temporal performance of the human fingertips. To detect contact events, the taxels utilize the contact forces induced change in the polarization level of piezoelectric polymer (and hence change in the induced channel current of MOS). The POSFET device on the chip have linear response in the tested dynamic contact forces range of 0.01–3 N and the sensitivity (without amplification) is 102.4 mV/N

Ultra-thin silicon based piezoelectric capacitive tactile sensor

This paper presents an ultra-thin bendable silicon based tactile sensor, in a piezoelectric capacitor configuration, realized by wet anisotropic etching as post-processing steps. The device is fabricated over bulk silicon, which is thinned down to 35 μm from an original thickness of 636 μm. Dicing of thin membrane is achieved by low cost novel technique of Dicing before Etching. The piezoelectric capacitor is composed of polyvinylidene fluoride trifluoroethylene (PVDF-TrFE), which present an attractive avenue for tactile sensing as they respond to dynamic contact events (which is critical for robotic tasks), easy to fabricate at low cost and are inherently flexible. The sensor exhibits enhanced piezoelectric properties, thanks to the optimization of the poling procedure. The sensor capacitive behaviour is confirmed using impedance analysis and the electro-mechanical characterization is done using TIRA shaker setup

Device modelling for bendable piezoelectric FET-based touch sensing system

Flexible electronics is rapidly evolving towards devices and circuits to enable numerous new applications. The high-performance, in terms of response speed, uniformity and reliability, remains a sticking point. The potential solutions for high-performance related challenges bring us back to the timetested silicon based electronics. However, the changes in the response of silicon based devices due to bending related stresses is a concern, especially because there are no suitable models to predict this behavior. This also makes the circuit design a difficult task. This paper reports advances in this direction, through our research on bendable Piezoelectric Oxide Semiconductor Field Effect Transistor (POSFET) based touch sensors. The analytical model of POSFET, complimented with Verilog-A model, is presented to describe the device behavior under normal force in planar and stressed conditions. Further, dynamic readout circuit compensation of POSFET devices have been analyzed and compared with similar arrangement to reduce the piezoresistive effect under tensile and compressive stresses. This approach introduces a first step towards the systematic modeling of stress induced changes in device response. This systematic study will help realize high-performance bendable microsystems with integrated sensors and readout circuitry on ultra-thin chips (UTCs) needed in various applications, in particular, the electronic skin (e-skin)

Stretchable pH Sensing Patch in a Hybrid Package

This work presents a novel stretchable pH sensing patch to detect the pH in body fluid which is one of the most important parameters in human health monitoring. The sensing patch is a hybrid package comprising of polyimide/gold-based stretchable interconnects and graphite composite-based flexible pH sensor. With the integration of stretchable interconnects, the patch is able to withstand external stretching up to 50% longer than its original length. Moreover, the electrical behavior of the patch does not degrade as studied by the real-time resistance investigation. In order to protect the connecting electrodes and wirings from direct contacting with solution under analysis, the sensing patch is encapsulated with elastic polymer with the active sensing area exposed. The fabricated patch reveals a high pH sensitivity of 36.2 μA/pH in the pH range between 5 and 9 which is validated through electrochemical and electroanalytical studies

Technologies for printing sensors and electronics over large flexible substrates: a review

Printing sensors and electronics over flexible substrates is an area of significant interest due to low-cost fabrication and possibility of obtaining multifunctional electronics over large areas. Over the years, a number of printing technologies have been developed to pattern a wide range of electronic materials on diverse substrates. As further expansion of printed technologies is expected in future for sensors and electronics, it is opportune to review the common features, complementarities and the challenges associated with various printing technologies. This paper presents a comprehensive review of various printing technologies, commonly used substrates and electronic materials. Various solution/dry printing and contact/non-contact printing technologies have been assessed on the basis of technological, materials and process related developments in the field. Critical challenges in various printing techniques and potential research directions have been highlighted. Possibilities of merging various printing methodologies have been explored to extend the lab developed standalone systems to high-speed roll-to-roll (R2R) production lines for system level integration