Thermal and Electrical Analysis of Solid Aluminium Capacitors

The thermal properties of electronic components partly determine the reliability of electronic equipment. For electrolytic capacitors, they also set the limits for the ripple current and voltage values

Proceedings on 7th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC 2001), September 24-27, 2001, Paris, France

ISBN: 2-913329-72-1THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronics microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The high element density of MCMs, the growing power dissipated in a package, etc., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system

5th International Workshop on THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES (THERMINIC 1999), October 3-6, 1999, ROME, Italy: Special Issue, Microelectronics Journal

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronics and microstructures. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The high element density of MCMs, the growing power dissipated in a package, etc., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system

Proceedings on 9th International Workshop on THERMAL INVESTIGATIONS of ICs and Systems (THERMINIC 2003), 24-26 September 2003, Aix-en-Provence, France

International audienceTHERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The high element density of MCMs, the growing power dissipated in a package, etc., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system

Proceedings on 10th International Workshop on THERMAL INVESTIGATIONS of ICs and Systems (THERMINIC 2004), 29 September - 1 October 2004, Sophia Antipolis, Côte d'Azur, France

ISBN: 2848430369THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of circuits packaged together and with the move to nanotechnology. These trends are calling for thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The growing power dissipated in a package, the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system

Proceedings on 8th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC 2002), 1-4 October 2002, Madrid, Spain

ISBN: 2-913329-97-7THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a systemÕs cost. The high element density of MCMs, the growing power dissipated in a package, etc., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system

THERmal Investigations of ICs and Systems (THERMINIC'08)

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of circuits packaged together and with the move to nanotechnology. Thermal management is expected to become an increasingly dominating factor of the cost of the total system. All these trends are calling for thermal simulation, monitoring and cooling. New developments such as the moving parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. In addition, new materials have to be created to assure the manageability of the increased thermal stress and to answer the challenges of the nano-era

Proceedings on 5th International Workshop on THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES (THERMINIC 1999) October 3-6, 1999,ROME, Italy

ISBN: 2-913329-32-2THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronics and microstructures. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The high element density of MCMs, the growing power dissipated in a package, etc., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system