81 research outputs found
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Progress at SLAC on high-power rf pulse compression
Rf pulse compression is a technique for augmenting the peak power output of a klystron (typically 50--100 MW) to obtain the high peak power required to drive a linear collider at a high accelerating gradient (typically 200 MW/m is required for a gradient of 100 MV/m). The SLED pulse compression system, with a power gain of about 2.6, has been operational on the SLAC linac for more than a decade. Recently, a binary pulse-compression system with a power gain of about 5.2 has been tested up to an output power of 120 MW. Further high-power tests are in progress. Our current effort is focused on prototyping a so-called SLED-II pulse-compression system with a power gain of four. Over-moded TE[sub 01]-mode circular waveguide components, some with novel technical features, are used to reduce losses at the 11.4-GHz operating frequency
Shear localization and recrystallization in dynamic deformation of 8090 Al-Li alloy
The microstructural evolution in localized shear deformation was investigated in an 8090 Al-Li alloy by split Hopkinson pressure bar (strain rate of approximately 10(3) s(-1)) at ambient temperature and 77 K. The alloy was tested in the peak-, over-, under-, and natural-aged conditions, that provide a wide range of microstructural parameters and mechanical properties. Two types of localized shear bands were distinguished by optical microscopy: the deformed shear band and the white-etching shear band. They form at different stages of deformation during localization. There are critical strains for the occurrence of deformed and white-etching localized shear deformation, at the imposed strain rate. Observations by transmission electron microscopy reveal that the white-etching bands contain fine equiaxed grains; it is proposed that they are the result of recrystallization occurring during localization. The deformed-type bands are observed after testing at 77 K in all heat treatment conditions, but they are not as well defined as those developed at ambient temperature. Cracking often occurs along the localized shear at ambient temperature. The decrement in temperature is favorable for the nucleation, growth and coalescence of the microcracks along the shear bands, inducing fracture
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