Search CORE

29 research outputs found

Anatomopatologia de amostras de bovinos alimentados com glicerol

Author: Adriano Tony Ramos
ANDRESEN H.
DI MARCO O.N.
Domenica Palomaris Mariano de Souza
DONKIN S.S.
DONKIN S.S.
Jean Pacheco Leão
José Neuman Miranda Neiva
João Restle
LAGE J.F.
LIN E.C.C.
MACH N.
MARTIM E.C.O.
PARSONS G.L.
RÉMOND B.
Sandro Estevan Moron
VALADARES FILHO S.
Viviane Mayumi Maruo
WANG C.
ZACARONI O.F.
Publication venue: 'FapUNIFESP (SciELO)'
Publication date
Field of study

The nucleotide sequence of Escherichia coli

Author: E.C.C. Lin
Zhe Lu
Publication venue: 'Oxford University Press (OUP)'
Publication date: 01/01/1989
Field of study

Glutamate-Glyoxylate Aminotransferase in Rat Liver Cytosol. Purification, Properties and Identity with Alanine-2-Oxoglutarate Aminotransferase

Author: Cooper A.J.L.
Ichihara A.
Katsunuma N.
Lin E.C.C.
Nakada H.I.
Nakatani Y.
Rowsell E.V.
Swick R.W.
Thompson J.S.
Thompson J.S.
Wada G.H.
Publication venue: 'Walter de Gruyter GmbH'
Publication date
Field of study

Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration

Author: C.M. Tsai
C.M. Tsai
C.R. Kao
C.Y. Liu
D. Gupta
E.C.C. Yeh
H. Gan
H. Ye
S. Gee
T.K. Hooghan
T.L. Shao
W.J. Choi
Y.C. Hsu
Y.C. Hu
Y.H. Lin
Y.H. Lin
Y.L. Lin
Y.L. Lin
Y.L. Lin
Y.S. Lai
Y.W. Lin
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

In-situ observation of material migration in flip-chip solder joints under current stressing

Author: A.T. Wu
A.T. Wu
C. M. Tsai
C. R. Kao
C. W. Chang
C.M. Tsai
D. Gupta
D. Halliday
E.C.C. Yeh
K.N. Tu
R.J. Klein Wassink
T.-Y.T. Lee
Y. L. Lin
Y.C. Hu
Y.H. Lin
Y.H. Lin
Y.H. Lin
Y.L. Lin
Yi-Shao Lai
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Diagnostic Problems of Disorders of Tyrosine Metabolism

Author: Buist N.R.M.
Carson N.A.J.
David M.M.
Gentz J.
Grant D.B.
Knox W.E.
LaDu B.N.
LaDu B.N.
Lin E.C.C.
Lindemann R.
Sakai K.
Willems C.
Zannoni V.G.
Publication venue: 'Wiley'
Publication date
Field of study

Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration

Author: C. M. Tsai
C. R. Kao
C.E. Ho
C.M. Tsai
C.M. Tsai
C.Y. Liu
E.C.C. Yeh
H. Gan
H. Ye
J.W. Nah
L.C. Shiau
T.L. Shao
T.L. Shao
W.J. Choi
Y. L. Lin
Y. S. Lai
Y.C. Hsu
Y.C. Hu
Y.H. Lin
Y.H. Lin
Y.L. Lin
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Electromigration-induced failure in flip-chip solder joints

Author: C. M. Tsai
C. R. Kao
E.C.C. Yeh
H. Ye
J.D. Wu
J.R. Black
K. Zeng
K.N. Tu
S. Brandenberg
Semiconductor Industry Association
T.Y. Lee
Y. C. Hu
Y. H. Lin
Y. L. Lin
Y.C. Hu
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Electromigration-Induced Void Formation at the Cu5Zn8/Solder Interface in a Cu/Sn-9Zn/Cu Sandwich

Author: B.J. Lee
E.C.C. Yeh
F.H. Huang
H. Ye
J.W. Nah
J.W. Yoon
K.N. Tu
Kwang-Lung Lin
L. Zhang
M.N. Islam
P. Shewmon
R.A. Islam
S.M. Kuo
Shih-Ming Kuo
T.C. Chang
T.Y. Lee
W.J. Choi
Y.H. Lin
Y.W. Chang
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Local melting induced by electromigration in flip-chip solder joints

Author: A.T. Wu
C. M. Tsai
C. R. Kao
C.Y. Liu
C.Y. Liu
E.C.C. Yeh
H. Ye
H. Ye
J. Y. Tsai
J.D. Wu
J.W. Nah
K. Jung
K. Zeng
K.N. Tu
Q.T. Huynh
S. Brandenberg
T.L. Shao
T.Y. Lee
Y. L. Lin
Y.C. Hsu
Y.C. Hu
Y.H. Lin
Y.H. Lin
Y.H. Lin
Yi-Shao Lai
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

core

core