Effects of Rapid Heating on Solutionizing Characteristics of Al-Si-Mg Alloys Using a Fluidized Bed

Effects of rapid heat transfer using a fluidized bed on the heat-treating response of Al-Si-Mg alloys (both unmodified and Sr modified) were investigated. The heating rate in the fluidized bed is greater than in conventional air convective furnaces. Particle size analyses of eutectic Si showed that the high heating rate during fluidized bed solution heat treatment causes faster fragmentation and spherodization of Si particles compared to conventional air convective furnaces. The mechanism of Si fragmentation through fluidized bed processing is through both brittle fracture and neck formation and its propagation. In contrast to this, the mechanism of Si fragmentation using a conventional air convective furnace is through neck formation and propagation. The Sr-modified D357 alloy showed a faster spherodizing rate than the unmodified alloy. Thermal analyses showed an exothermic reaction during solution heat treatment using a fluidized bed due to recrystallization, and coarsening of eutectic Al grains. Whereas the alloy solutionized using a conventional air convective furnace showed two exothermic reactions, one due to annihilation of point defects and the other due to recrystallization, and coarsening of the eutectic grains in the aluminum matrix. The recrystallization temperature of the alloy solutionized in the fluidized bed is lower than those in the conventional air convective furnace. Both tensile strength and elongation of fluidized bed solutionized alloys are greater than those solutionized using the air convective furnace. The optimum heat-treatment time for T4 temper using a fluidized bed for unmodified and Sr-modified alloy was reduced to 60 and 30 minutes, respectively

Recent Observations on Tin Pest Formation in Solder Alloys

The most recent observations of the response of bulk samples of several lead-free solder alloys, exposed to temperatures below the allotropic transition for tin for extended periods, are reported. Tin pest has been observed in Sn-0.5Cu, Sn-3.5Ag, Sn-3.8Ag-0.7Cu, and Sn-3.0Ag-0.5Cu alloys at both -18 degrees C and -40 degrees C. The process is slow and inconsistent, usually requiring several years, but may eventually result in complete disintegration of the sample. No tin pest was detected in Sn-Zn-3Bi or in the traditional Sn-37Pb solder alloy after exposure for up to 4 and 10 years, respectively. It is suggested that nucleation is affected by local composition and that extremely small amounts of either intentional solute or impurity are influential. Growth of tin pest is accompanied by a large volume change, and it is likely that stress relaxation ahead of the expanding grey tin front is a controlling factor. A stronger matrix would be more resistant in this case, and at the temperatures of exposure Sn-37Pb is stronger than either Sn-3.5Ag or Sn-0.5Cu. The absence of tin pest, to date, on actual joints is attributed to their restricted free surface area and the greater strength associated with very small samples