Including SMT Ferrite Beads in DC Power Bus and High-Speed I/O Line Modeling

Surface mount technology (SMT) ferrite beads are often used in high-speed digital circuit designs to mitigate noise. The common modeling approach is to include SMT ferrite beads as equivalent lumped LCR circuits. The work presented in this paper included SMT ferrite beads as a frequency-dependent impedance in a PEEC-like modeling tool denoted CEMPIE, a circuit extraction approach based on a mixed-potential integral equation formulation. Agreement with measurements demonstrates the approach. The applications shown are segmentation of power areas for noise isolation, and I/O line filtering

The Design of a Lumped Element Impedance-Matching Network with Reduced Parasitic Effects Obtained From Numerical Modeling

This paper presents an impedance-matching network design with numerical modeling of the parasitic effects. A modeling tool CEMPIE (a Circuit Extraction approach based on a Mixed Potential Integral Equation formulation) is used to model the hoard-level parasitics of surface mount technology (SMT) resistors for impedance-matching networks. A 3-layer design of impedance-matching network with 0402 SMT resistors is implemented according to the modeling results. And its performance is demonstrated

Modeling Noise Coupling from Non-Parallel PCB Trace Routing

Coupling between PCB signal traces in proximity is of concern to PCB designers and EMC engineers. The behavior of noise coupling between non-parallel microstrip lines is studied in this paper by a full-wave numerical modeling method CEMPIE, designating a circuit extraction approach based on a mixed-potential integral equation formulation. Good agreement between the numerical results and measurements was obtained

Validation of Circuit Extraction Procedure by Means of Frequency and Time Domain Measurement

Aim of this paper is the validation in both frequency and time domain of the procedure to extract fully H-Spice compatible equivalent circuits of structures on printed circuit boards. The procedure is initiated by standard measurement of scattering parameters between 40MHz to 20GH. After the extraction of the equivalent circuit, the computed scattering parameters are compared with those measured. The same equivalent circuit is also used for transient analysis in order to compare TDR measurement and eye-pattern to a pseudo-random bit sequence with those coming from the simulations

Extracting CAD Models for Quantifying Noise Coupling Between Vias in PCB Layouts

A method to extract a lumped element prototype SPICE model is used to study noise coupling between non-parallel traces on a PCB. The parameters in this model are extracted using a PEEC-like approach, a Circuit Extraction approach based on a Mixed-Potential Integral Equation formulation (CEMPIE). Without large numbers of unknowns, the SPICE model saves computation time. Also, it is easy to incorporate into system SPICE net list to acquire the system simulation result considering the coupling between traces on the printed circuit board (PCB). A representative case is studied, and the comparison of measurements, CEMPIE simulation, and SPICE modeling are given

An Efficient Approach for Power Delivery Network Design with Closed-Form Expressions for Parasitic Interconnect Inductances

Investigation of a dc power delivery network, consisting of a multilayer PCB using area fills for power and return, involves the distributed behavior of the power/ground planes and the parasitics associated with the lumped components mounted on it. Full-wave methods are often employed to study the power integrity problem. While full-wave methods can be accurate, they are time and memory consuming. The cavity model of a rectangular structure has previously been employed to efficiently analyze the simultaneous switching noise (SSN) in the power distribution network. However, a large number of modes in the cavity model are needed to accurately simulate the impedance associated with the vias, leading to computational inefficiency. A fast approach is detailed herein to accelerate calculation of the summation associated with the higher-order modes. Closed-form expressions for the parasitics associated with the interconnects of the decoupling capacitors are also introduced. Combining the fast calculation of the cavity models of regularly shaped planar circuits, a segmentation method, and closed-form expressions for the parasitics, an efficient approach is proposed herein to analyze an arbitrary shaped power distribution network. While it may take many hours for a full-wave method to do a single simulation, the proposed method can generally perform the simulation with good accuracy in several minutes. Another advantage of the proposed method is that a SPICE equivalent circuit of the power distribution network can be derived. This allows both frequency and transient responses to be done with SPICE simulation

The Leishmania donovani LD1 locus gene ORFG encodes a biopterin transporter (BT1)

We have previously described two genes, ORFF and ORFG, from the LD1 locus near one telomere of chromosome 35, which are frequently amplified in Leishmania isolates. In Leishmania donovani LSB-51.1, gene conversion of the rRNA gene locus on chromosome 27 with these two genes resulted in their over-expression, because of their transcription by the RNA polymerase I-mediated rRNA promoter. The predicted ORFG protein has substantial sequence homology to the ESAG10 gene product from the Trypanosoma brucei VSG expression site and both are putative membrane proteins. Using successive rounds of gene replacement of the three ORFG genes in L. donovani LSB-51.1, ORFG null mutants were obtained. These mutant cell lines show a direct relationship between ORFG mRNA, protein expression levels and active transport of biopterin into the cells. Transformation of the null mutant with a plasmid containing ORFG restores biopterin transport activity. In addition, the null mutants are unable to grow in the absence of supplemental biopterin. Thus, ORFG encodes a biopterin transporter and has been renamed BT1

Extraction of a SPICE Via Model from Full-Wave Modeling for Differential Signaling

This paper presents a procedure for building SPICE models for via transitions in differential signaling. The method of extracting parameters of SPICE models from a full-wave simulation tool is demonstrated. Then the validity of the SPICE models is studied by comparing the solution from the SPICE models with that from the full-wave simulation

Validation of Equivalent Circuits Extracted from S-Parameter Data for Eye-pattern Evaluation

S-parameter circuit model extraction is usually characterized by a trade off between accuracy and complexity. Trading one feature for another may or may not affect the goodness of the reconstructed S-parameter data, which are obtained from frequency domain simulations of the models extracted. However, the ultimate test for the validity of these equivalent circuit representations should be left to eye-diagram simulations, which provide useful insights, from an SI point of view, about the degradation of the signal, as it travels through the system. Physics based simplication procedures can be used to tune the models and achieve less complexity, whereas the comparisons of the eye-diagrams may help to quantify the goodness of an these circuits extracted. In fact, the most accurate model is not necessary the best to be used

Integration of decision support systems to improve decision support performance

Decision support system (DSS) is a well-established research and development area. Traditional isolated, stand-alone DSS has been recently facing new challenges. In order to improve the performance of DSS to meet the challenges, research has been actively carried out to develop integrated decision support systems (IDSS). This paper reviews the current research efforts with regard to the development of IDSS. The focus of the paper is on the integration aspect for IDSS through multiple perspectives, and the technologies that support this integration. More than 100 papers and software systems are discussed. Current research efforts and the development status of IDSS are explained, compared and classified. In addition, future trends and challenges in integration are outlined. The paper concludes that by addressing integration, better support will be provided to decision makers, with the expectation of both better decisions and improved decision making processes